| 31/Mar/2020 | 84864030 | Mold used to print tin solder paste on printed circuit boards (TA800JXE_VE), for solder paste printing machines, 100% new. | Korea (Republic) | piece/pcs | 1.00 | 508.04 | 508.04 | View Importer | View Supplier |
| 31/Mar/2020 | 84864030 | Mold used to print tin solder paste on printed circuit boards (TA200EXE_VE2), used for solder paste printing machines, 100% new. | Korea (Republic) | piece/pcs | 10.00 | 1,673.62 | 167.36 | View Importer | View Supplier |
| 28/Mar/2020 | 84864030 | Mold for manufacturing Metal Mask 95.2585T00 TOP semiconductor components, stainless steel material. New 100% . | Vietnam | piece/pcs | 1.00 | 107.14 | 107.14 | View Importer | View Supplier |
| 27/Mar/2020 | 84864030 | The bottom mold is used to print solder paste onto the printed circuit board (ETA0U83EWE) for solder paste printing machine, 100% new. | Korea (Republic) | piece/pcs | 1.00 | 292.92 | 292.92 | View Importer | View Supplier |
| 27/Mar/2020 | 84864030 | The bottom mold is used to print solder paste onto the printed circuit board (ETA0U83EWE) for solder paste printing machine, 100% new. | Korea (Republic) | piece/pcs | 1.00 | 292.92 | 292.92 | View Importer | View Supplier |
| 27/Mar/2020 | 84864030 | The bottom mold is used to print solder paste onto the printed circuit board (ETA3U30EBE) for solder paste printing machine, 100% new. | Korea (Republic) | piece/pcs | 1.00 | 292.92 | 292.92 | View Importer | View Supplier |
| 25/Mar/2020 | 84864030 | Bottom mold for molding machines using compression molds, used in the manufacture of semiconductor panels, model: M200207-0409-1 | Korea (Republic) | piece/pcs | 1.00 | 2,834.37 | 2,834.37 | View Importer | View Supplier |
| 25/Mar/2020 | 84864030 | Bottom die making mold for die casting machine using compression molds, used in semiconductor sheet manufacturing, model: M200207-0409-2 | Korea (Republic) | piece/pcs | 1.00 | 2,834.37 | 2,834.37 | View Importer | View Supplier |
| 25/Mar/2020 | 84864030 | Bottom die making mold for die casting machine using compression molds, used in semiconductor sheet manufacturing, model: M200207-0409-3 | Korea (Republic) | piece/pcs | 1.00 | 2,834.37 | 2,834.37 | View Importer | View Supplier |
| 25/Mar/2020 | 84864030 | Bottom die making mold for die casting machine using compression molds, used in semiconductor sheet manufacturing, model: M200207-0409-4 | Korea (Republic) | piece/pcs | 1.00 | 2,834.37 | 2,834.37 | View Importer | View Supplier |
| 25/Mar/2020 | 84864030 | Bottom mold for molding machines using compression molds, used in the manufacture of semiconductor panels, model: M200207-0409-5 | Korea (Republic) | piece/pcs | 1.00 | 2,834.37 | 2,834.37 | View Importer | View Supplier |
| 24/Mar/2020 | 84864030 | Tin sealer used for printing solder paste onto a printed circuit board (EP-TA845) of the laptop power adapter for solder paste printers, 100% new | Korea (Republic) | piece/pcs | 1.00 | 421.00 | 421.00 | View Importer | View Supplier |
| 05/Mar/2020 | 84864030 | Bottom mold for molding machines using compression molds, used in the manufacture of semiconductor sheets, model: M200048-0408-4 (TN item No. 01 TK 303037665620 / 13.02.2020) | Japan | piece/pcs | 1.00 | 3,600.00 | 3,600.00 | View Importer | View Supplier |
| 05/Mar/2020 | 84864030 | Bottom mold for molding machines using compression molds, used in the manufacture of semiconductor panels, model: M200024-0408-3 (TN item No. 02 TK 303037665620 / 13.02.2020) | Japan | piece/pcs | 1.00 | 3,600.00 | 3,600.00 | View Importer | View Supplier |
| 05/Mar/2020 | 84864030 | Bottom mold for molding machines using compression molds, used in the manufacture of semiconductor sheets, model: M200048-0408-2 (TN item No. 03 TK 303037665620 / 13.02.2020) | Japan | piece/pcs | 1.00 | 3,600.00 | 3,600.00 | View Importer | View Supplier |
