| 28/Mar/2020 | 84864020 | 700021517 # & TCB CHIP TO SUBSTRATE BONDER, DUAL STAGE | China | piece/pcs | 1.00 | 626,136.36 | 626,136.36 | View Importer | View Supplier |
| 27/Mar/2020 | 84864020 | 700021517 # & TCB CHIP TO SUBSTRATE BONDER, DUAL STAGE | China | piece/pcs | 1.00 | 626,136.36 | 626,136.36 | View Importer | View Supplier |
| 27/Mar/2020 | 84864020 | 700021517 # & TCB CHIP TO SUBSTRATE BONDER, DUAL STAGE | China | piece/pcs | 1.00 | 626,136.36 | 626,136.36 | View Importer | View Supplier |
| 26/Mar/2020 | 84864020 | 700020139 # & JEDEC LP REV3 | Philippines | piece/pcs | 1.00 | 64,762.00 | 64,762.00 | View Importer | View Supplier |
| 26/Mar/2020 | 84864020 | 700020139 # & JEDEC LP REV3 | Philippines | piece/pcs | 1.00 | 64,762.00 | 64,762.00 | View Importer | View Supplier |
| 26/Mar/2020 | 84864020 | Wire-attaching device to the product and associated accessory - Wire Bonder (Re-enter Section 3 TK302972954230, January 3, 2020) | Japan | set | 1.00 | 53,965.06 | 53,965.06 | View Importer | View Supplier |
| 21/Mar/2020 | 84864020 | 700021517 # & TCB CHIP TO SUBSTRATE BONDER, DUAL STAGE | China | piece/pcs | 1.00 | 626,136.36 | 626,136.36 | View Importer | View Supplier |
| 19/Mar/2020 | 84864020 | '# & Automatic machine attaching gold thread to the surface of wafer semiconductor plate in manufacturing integrated circuit (wafer level bonder), model: ATPremier LITE, SN: WL10002-1839662,240V; 8.4A; 50 / 60Hz, sx : 2020, firm: Kulicke & Soffa | Singapore | piece/pcs | 1.00 | 161,500.00 | 161,500.00 | View Importer | View Supplier |
| 19/Mar/2020 | 84864020 | '# & Automatic machine attaching gold thread to the surface of wafer semiconductor plate in manufacturing integrated circuit (wafer level bonder), model: ATPremier LITE, SN: WL10004-1839666,240V; 8.4A; 50 / 60Hz, production: 2020, firm: Kulicke & Soffa | Singapore | piece/pcs | 1.00 | 161,500.00 | 161,500.00 | View Importer | View Supplier |
| 19/Mar/2020 | 84864020 | '# & Automatic machine attaching gold thread to the surface of wafer semiconductor plate in manufacturing integrated circuit (wafer level bonder), model: ATPremier LITE, SN: WL10003-1786728, 240V; 8.4A; 50 / 60Hz, production: 2020, firm: Kulicke & Soffa | Singapore | piece/pcs | 1.00 | 161,500.00 | 161,500.00 | View Importer | View Supplier |
| 19/Mar/2020 | 84864020 | '# & Automatic machine attaching gold thread to the surface of wafer semiconductor plate in manufacturing integrated circuit (wafer level bonder), model: ATPremier LITE, SN: WL10006-1839670,240V; 8.4A; 50 / 60Hz, sx : 2020, firm: Kulicke & Soffa | Singapore | piece/pcs | 1.00 | 161,500.00 | 161,500.00 | View Importer | View Supplier |
| 19/Mar/2020 | 84864020 | '# & Automatic machine attaching gold thread to the surface of wafer semiconductor plate in manufacturing integrated circuit (wafer level bonder), model: ATPremier LITE, SN: WL10005-1839668,240V; 8.4A; 50 / 60Hz, sx : 2020, firm: Kulicke & Soffa | Singapore | piece/pcs | 1.00 | 161,500.00 | 161,500.00 | View Importer | View Supplier |
| 16/Mar/2020 | 84864020 | 700020137 # & JEDEC LP REV3 W / MTP | Philippines | piece/pcs | 1.00 | 67,658.00 | 67,658.00 | View Importer | View Supplier |
| 16/Mar/2020 | 84864020 | 700020137 # & JEDEC LP REV3 W / MTP | Philippines | piece/pcs | 1.00 | 67,658.00 | 67,658.00 | View Importer | View Supplier |
| 13/Mar/2020 | 84864020 | Transistor cutting machine / FULLY AUTOMATIC DICING SAW, model: DISCO DFD6363; Serial: SX1007, year of manufacture: 2020; Accessories included: 6 cutting knives, 30 chips to test the machine. | Japan | set | 1.00 | 225,000.00 | 225,000.00 | View Importer | View Supplier |
