| 20/Mar/2020 | 29151100 | Fomic acid additive corrosive effect in the plating process of printed circuit FE-600R (formic acid 1-10%, water (Balance), 100% new goods (1 can = 20 Liters) | Korea (Republic) | liter | 4,800.00 | 10,996.32 | 2.29 | View Importer | View Supplier |
| 06/Mar/2020 | 29161490 | 0 # & Chemicals s / d to resist oxidized copper after Etching or printed circuit board copper plating (Triethanol amine 3%, 2-Methyl-2,4-pentanediol 25%, compound 67%, Organic nitrogen 25%) (TOP RINSE CU-5) (SB030100051) | Japan | liter | 504.00 | 13,083.29 | 25.96 | View Importer | View Supplier |
| 06/Mar/2020 | 29161490 | 0 # & Chemicals s / d to resist oxidized copper after Etching or printed circuit board copper plating (Triethanol amine 3%, 2-Methyl-2,4-pentanediol 25%, compound 67%, Organic nitrogen 25%) (TOP RINSE CU-5) (SB030100051) | Japan | liter | 126.00 | 3,245.79 | 25.76 | View Importer | View Supplier |
| 06/Mar/2020 | 29161490 | 0 # & Chemicals s / d to resist oxidized copper after Etching or printed circuit board copper plating (Triethanol amine 3%, 2-Methyl-2,4-pentanediol 25%, compound 67%, Organic nitrogen 25%) (TOP RINSE CU-5) (SB030100051) | Japan | liter | 414.00 | 10,664.72 | 25.76 | View Importer | View Supplier |
| 14/Jan/2019 | 29161490 | 0 # & Chemicals used to resist oxidation of copper after Ethcing or copper plating of printed circuit boards. (TOP RINSE CU-5 (240 * 240 * 350)) (MA040405186) , 100% new | Japan | Lit | 90.00 | 2,427.84 | 26.98 | View Importer | View Supplier |
