| 30/Jan/2019 | 38249999 | CIRCUPOSIT 6530 CAT (VN) / 20L without water> 98% and Inorganic salt <1%. It helps to promote the process of forming the copper layer inside the hole of the board. In electronic circuit manufacturing technology | Japan | Lit | 1,280.00 | 51,013.10 | 39.85 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | CIRCUPOSIT 6530 CAT (VN) / 20L without water> 98% and Inorganic salt <1%. It helps to promote the process of forming the copper layer inside the hole of the board. In electronic circuit manufacturing technology | Japan | Lit | 400.00 | 15,779.37 | 39.45 | View Importer | View Supplier |
| 14/Jan/2019 | 38249999 | CIRCUPOSIT (TM) 6536 BUFFER SOLUTION without water 90-99% , potassium salt 1-10%. to accelerate the process of forming the copper layer inside the board's hole walls. In electronic circuit manufacturing technology | China | Lit | 100.00 | 834.35 | 8.34 | View Importer | View Supplier |
| 11/Jan/2019 | 38249999 | Desulfurant in steel making process , containing Fe2O3: 35% , CaSO4.55% , NSX: Yueyang Haida Environmental Protection Technology CO. , LTD. 100% new | China | Kg | 36,000.00 | 0.61 | 0.00 | View Importer | View Supplier |
| 04/Jan/2019 | 38249999 | CIRCUPOSIT 6530 CAT (VN) / 20L without water> 98% and Inorganic salt <1%. It has the effect of promoting the process of forming the copper layer inside the board's hole wall. In electronic circuit manufacturing technology | Japan | Lit | 1,920.00 | 75,745.47 | 39.45 | View Importer | View Supplier |
