| 30/Jan/2019 | 38249999 | 0 # & Additives in the process of plating PCB boards, KP-3 (Ethanol components 1-3% , Monoethanolamine 1-3% , Water 90-96%. New products 100% | Vietnam | Lit | 100.00 | 218.96 | 2.19 | View Importer | View Supplier |
| 30/Jan/2019 | 38249999 | CIRCUPOSIT 6530 CAT (VN) / 20L without water> 98% and Inorganic salt <1%. It helps to promote the process of forming the copper layer inside the hole of the board. In electronic circuit manufacturing technology | Japan | Lit | 1,280.00 | 51,013.10 | 39.85 | View Importer | View Supplier |
| 28/Jan/2019 | 38101000 | processing treatment cleaning metal surfaces Top SEAL E-125 , liquid , tp: inorganic salt , disodium salt , water , 20 liters / can , new 100% (cas134684-88-1 , 9084-06-4 , 39-33-3 , 7732-18-5) , Business results: 972 / TB-TCHQ | Japan | Lit | 20.00 | 157.53 | 7.88 | View Importer | View Supplier |
| 25/Jan/2019 | 39140000 | Ion exchange particle MB115 , used in water filtration process. 100% new # & PRINT | India | Lit | 400.00 | 2,349.38 | 5.87 | View Importer | View Supplier |
| 23/Jan/2019 | 38249999 | The main ingredient is zinc hydroxide , sodium hydroxide , water-soluble form , used as an additive in plating process - SUBSTAR ZN-8 (20LTS) (KÐÐ: S?: 2420 / TB-TCHQ Day 3/23/2015 (CAS-1310-7 | Thailand | Lit | 20.00 | 126.30 | 6.31 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | CIRCUPOSIT 6530 CAT (VN) / 20L without water> 98% and Inorganic salt <1%. It helps to promote the process of forming the copper layer inside the hole of the board. In electronic circuit manufacturing technology | Japan | Lit | 400.00 | 15,779.37 | 39.45 | View Importer | View Supplier |
| 15/Jan/2019 | 38249999 | Chemical ORC-445R (sulfuric acid 1-3% , palladium <1% , additive: 1-2% , Water (balance) , used as an additive in plate plating process | Korea (Republic) | Lit | 1,440.00 | 81,244.80 | 56.42 | View Importer | View Supplier |
| 15/Jan/2019 | 38249999 | ORC-410B (containing Sodium hydroxide 17-21% , Monoethanolamine 16-20% , water balance) , used as an additive in the plating process. New 100% | Korea (Republic) | Lit | 400.00 | 724.00 | 1.81 | View Importer | View Supplier |
| 14/Jan/2019 | 28070000 | Additives in the process of plating boards ORC-372 (Sulfuric acid 43 ~ 47% , Water (balance)) , 100% new | Korea (Republic) | Lit | 2,160.00 | 7,084.80 | 3.28 | View Importer | View Supplier |
| 14/Jan/2019 | 38249999 | CIRCUPOSIT (TM) 6536 BUFFER SOLUTION without water 90-99% , potassium salt 1-10%. to accelerate the process of forming the copper layer inside the board's hole walls. In electronic circuit manufacturing technology | China | Lit | 100.00 | 834.35 | 8.34 | View Importer | View Supplier |
| 14/Jan/2019 | 38249999 | Additives in the process of plating board , ORC-340B (OXIDIZER) (-Sodium hydroxide 23 ~ 25% -Water (balance)) , 100% new | Korea (Republic) | Lit | 3,600.00 | 6,696.00 | 1.86 | View Importer | View Supplier |
| 14/Jan/2019 | 38249999 | Additives in the process of plating the circuit board ORC-410B (CONDITIONER) (Sodium hydroxide 17 ~ 21% , Monoethanolamine 16 ~ 20% , Water (balance)) , 100% new | Korea (Republic) | Lit | 2,880.00 | 18,835.20 | 6.54 | View Importer | View Supplier |
| 14/Jan/2019 | 38249999 | Additives in the process of plating circuit , ORC-315H (SWELLER) (-Butyl Cabitol 17 ~ 19% -Monoethanolamine 16 ~ 18% -Water (balance)) , 100% new | Korea (Republic) | Lit | 2,880.00 | 16,041.60 | 5.57 | View Importer | View Supplier |
| 14/Jan/2019 | 38249999 | Additives in the process of plating circuit boards 445R (CATALYST) (Sulfuric acid 1 ~ 3% , Palladium 0.5 ~ 1% , Water (balance)) , 100% new | Korea (Republic) | Lit | 2,880.00 | 199,819.64 | 69.38 | View Importer | View Supplier |
| 14/Jan/2019 | 29151100 | Additive in the process of creating printed circuit boards FE-600R (formic acid 1-10% , water (Balance) , new goods 100% | Korea (Republic) | Lit | 4,800.00 | 10,996.36 | 2.29 | View Importer | View Supplier |
