27/Mar/2020 | 34059010 | 07010111 # & Clean Etch CPB-79-1 contains sulfuric acid (H2SO4) <5%, hydrogen peroxide (H2O2) 35% and water - used to support the surface grinding and polishing process. | Japan | kg | 20,000.00 | 36,800.00 | 1.84 | View Importer | View Supplier |
17/Mar/2020 | 34059010 | 2.330.020S # & Metal polishing wax in compressed form ZH-G80, (raw materials do not constitute products, fully consumed in the manufacturing process), 100% new | China | piece/pcs | 600.00 | 1,141.62 | 1.90 | View Importer | View Supplier |
16/Mar/2020 | 34059010 | 07010111 # & Clean Etch CPB-79-1 contains sulfuric acid (H2SO4) <5%, hydrogen peroxide (H2O2) 35% and water - used to support the surface grinding and polishing process. | Japan | kg | 20,000.00 | 36,800.00 | 1.84 | View Importer | View Supplier |
13/Mar/2020 | 34059010 | PL48 # & Polishing wax (Used to polish metal products, Consume completely during manufacturing process), New 100% | China | piece/pcs | 100.00 | 112.85 | 1.13 | View Importer | View Supplier |
07/Mar/2020 | 34059010 | Polished wax (Used to polish metal products, Consumable completely during manufacturing process), (CDM from line 3 of Account No. 103079414540 / E31 30/12/2019) | China | piece/pcs | 0.09 | 0.10 | 1.13 | View Importer | View Supplier |
03/Mar/2020 | 34059010 | PL48 # & Polishing wax (Used to polish metal products, Consume completely during manufacturing process), New 100% | China | piece/pcs | 50.00 | 59.38 | 1.19 | View Importer | View Supplier |
03/Mar/2020 | 34059010 | 07010111 # & Clean Etch CPB-79-1 contains sulfuric acid (H2SO4) <5%, hydrogen peroxide (H2O2) 35% and water - used to support the surface grinding and polishing process. | Japan | kg | 20,000.00 | 36,800.00 | 1.84 | View Importer | View Supplier |
11/Jan/2019 | 34059010 | Clean Etch grinding chemicals CPB-79-1 contain sulfuric acid (H2SO4) <5% , hydrogen peroxide (H2O2) 35% and water - used to support the grinding process , polishing the surface of the board. | Japan | Kg | 20,000.00 | 37,300.00 | 1.87 | View Importer | View Supplier |
08/Jan/2019 | 34059010 | Clean Etch grinding chemicals CPB-79-1 contain sulfuric acid (H2SO4) <5% , hydrogen peroxide (H2O2) 35% and water - used to support the grinding process , polishing the surface of the board. | Japan | Kg | 20,000.00 | 37,300.00 | 1.87 | View Importer | View Supplier |