31/Mar/2020 | 38101000 | TRI Chemical, cleaning metal surfaces, used in metal plating process. Chemical ingredients: sulfuric acid 29% -35%, Proprietary additive mixture max 5% and water. New 100% | Japan | liter | 8,000.00 | 86,720.00 | 10.84 | View Importer | View Supplier |
28/Mar/2020 | 38101000 | Flux: Flux AG8 paste, used in mechanical processing, Stella cc house, 100% new. | Italy | kg | 20.00 | 430.39 | 21.52 | View Importer | View Supplier |
18/Mar/2020 | 38101000 | Epclen P12, A mixture of Sodium bisulfate (50-80%) CAS: 7681-38-1, Proprietary Substances (20-50%). (Use corrosion of metal surfaces during plating process). PTPL: 571 / TB-KD3 (March 29, 19) | Thailand | kg | 50.00 | 125.00 | 2.50 | View Importer | View Supplier |
17/Mar/2020 | 38101000 | Blackhole af Replenisher LPH surface treatment agent is used to clean the circuit board during the plating process (containing Potassium Carbonate 1-10%, Carbon 1-10%, Water balance) (Not KBHC, TC). 100% | Taiwan | liter | 20.00 | 4,700.00 | 235.00 | View Importer | View Supplier |
17/Mar/2020 | 38101000 | Blackhole af Starter Hs surface treatment agent is used to clean the circuit board during the plating process (containing Potassium Carbonate 0.5-2%, Carbon 0.5-2%, Water balance) (Not KBHC, TC). 100% | Taiwan | liter | 160.00 | 8,640.00 | 54.00 | View Importer | View Supplier |
16/Mar/2020 | 38101000 | CS-CPLASAKL # & ACCELERATOR 131 metal surface cleaning product (AC-131): liquid (NaNO2, water) (Not directly involved in SP manufacturing process) | Vietnam | kg | 175.00 | 449.75 | 2.57 | View Importer | View Supplier |
16/Mar/2020 | 38101000 | CS-CPLASAKL # & KL FINE CLEANER 4360 (FC-4360): powder (Na2SiO3: 40-50%, phosphate compound: 30-40%, Na2CO3: 10-20%, surfactant: 1 -10%) (Do not participate directly in the process of manufacturing products) | Japan | kg | 700.00 | 3,164.00 | 4.52 | View Importer | View Supplier |
16/Mar/2020 | 38101000 | CS-CPLASAKL # & KL PALBOND L44R surface cleaning preparations (PB-L44R): liquid (Zn (H2PO4) 2: 30-40%, Zn (NO3) 2: 10-20%, H3PO4: 10-20% , Ni (NO3) 2: 0.1-1%, water) (Not directly involved in SP manufacturing process) | Vietnam | kg | 850.00 | 3,009.00 | 3.54 | View Importer | View Supplier |
16/Mar/2020 | 38101000 | CS-CPLASAKL # & ACCELERATOR 1 (AC-1) metal surface cleaning product: liquid (Zn (NO3) 2: 40-50%, water) (Not directly involved in SP manufacturing process) | Vietnam | kg | 175.00 | 603.75 | 3.45 | View Importer | View Supplier |
16/Mar/2020 | 38101000 | CS-CPLASAKL # & NEUTRALIZER 4055 metal surface cleaning product (NT-4055): liquid, (NaOH: 20-30%, water) (Not directly involved in SP manufacturing process) | Vietnam | kg | 180.00 | 513.00 | 2.85 | View Importer | View Supplier |
12/Mar/2020 | 38101000 | Preparations processing, cleaning metal surfaces KC-1024- Metal Cleaning Additive KC-1024 | Taiwan | kg | 180.00 | 993.60 | 5.52 | View Importer | View Supplier |
12/Mar/2020 | 38101000 | Preparations processing, cleaning metal surfaces 710PH- Metal Cleaning Additive 710PH | Taiwan | kg | 600.00 | 2,160.00 | 3.60 | View Importer | View Supplier |
10/Mar/2020 | 38101000 | Welding fluxes used in the welding process of mobile phone boards (SAC305 INDIUM 8.9 HFA TYPE 4.5 87.75% PASTEOT-800830-CAR); 2FSN-K10350; HMC00-0001 | Singapore | kg | 294.00 | 18,963.00 | 64.50 | View Importer | View Supplier |
04/Mar/2020 | 38101000 | Brazing Flux (cream, used to clean metal surfaces, for soldering processes) / ARARWFA00050 (454 GR / BOX U TYPE), (TP: H3BO3 (boric acid) 36.1%: KHF2: 6.9%: KBF4; 27.4%; KF 15%: H2O 14.6%) | United States of America | bottle / jar / tube | 20.00 | 441.00 | 22.05 | View Importer | View Supplier |
30/Jan/2019 | 38101000 | Welding fluxes used in the welding process of mobile phone boards (SAC305 INDIUM 8.9HFA TYPE 4.5 87.75% PASTEOT-800830-CAR) , HANG MOI 100% , 2FSN-J10019 | Singapore | Kg | 378.00 | 24,381.00 | 64.50 | View Importer | View Supplier |