27/Mar/2020 | 38249999 | 07030241 # & Chemical IM-GOLD IB2X CONDUCTIVE SALT REPLENISHER, composed of 95% sodium malonate; sodium thiosulfate 5% | Japan | kg | 80.00 | 3,584.79 | 44.81 | View Importer | View Supplier |
27/Mar/2020 | 38249999 | 07030243 # & Chemical IM-GOLD IB2X REPLENISHER, composed of 1% potassium citrate; citric acid 1%; succinic acid 2%; water 96% | Japan | liter | 50.00 | 12,220.87 | 244.42 | View Importer | View Supplier |
27/Mar/2020 | 38249999 | 07030241 # & Chemical IM-GOLD IB2X CONDUCTIVE SALT REPLENISHER, composed of 95% sodium malonate; sodium thiosulfate 5% | Japan | kg | 30.00 | 1,344.30 | 44.81 | View Importer | View Supplier |
25/Mar/2020 | 38249999 | Preparations of chemicals used in the plating industry are mainly composed of phosphorus NOVOPLATE HS REPLENISHER, CAS number: 15475-67-9; 13598-36-2 | China | kg | 50.00 | 130.00 | 2.60 | View Importer | View Supplier |
25/Mar/2020 | 38249999 | CO-5167463 # & Chemical preparations for plating industry OROLUX 800 C REPLENISHER, CAS number: 20427-59-2; 1336-21-6; 10043-35-3. (M.5167463) | Slovenia | kg | 50.00 | 3,861.58 | 77.23 | View Importer | View Supplier |
24/Mar/2020 | 38249999 | CM-00169 # & Cuposit 1120SR Copper Replenisher for plating industry (Pyridine compound <1%; Sulfuric Acid H2SO4 <1%, Water> 98% (Omnishield 1120SR) | Japan | liter | 20.00 | 300.00 | 15.00 | View Importer | View Supplier |
24/Mar/2020 | 38249999 | CM-00169 # & Cuposit 1120SR Copper Replenisher for plating industry (Pyridine compound <1%; Sulfuric Acid H2SO4 <1%, Water> 98% (Omnishield 1120SR) | Japan | liter | 40.00 | 600.00 | 15.00 | View Importer | View Supplier |
23/Mar/2020 | 38249999 | PSCB-AUROTECH-CNN-PART A # & Chemical replenishment part a - replenishment part a (2130 / N3.13 / TD 25/11/2013). NICKEL, ACID, water, plating preparations (finishing substances). | Malaysia | kg | 120.00 | 1,054.80 | 8.79 | View Importer | View Supplier |
23/Mar/2020 | 38249999 | PSCB-AUROTECH-CNN-PART A # & Chemical replenishment part a - replenishment part a (2130 / N3.13 / TD 25/11/2013). NICKEL, ACID, water, plating preparations (finishing substances). | Malaysia | kg | 90.00 | 791.10 | 8.79 | View Importer | View Supplier |
20/Mar/2020 | 38249999 | MULTIBOND MP REPLENISHER circuit board (20L / CAN), (1-10% sodium hydroxide) / KH00B0 (according to item No. 09 TKKNQ: 103204714650 / C11) | Taiwan | liter | 500.00 | 5,750.00 | 11.50 | View Importer | View Supplier |
18/Mar/2020 | 38249999 | TG214Rep # & TG214 Replenisher metal plating salt | Korea (Republic) | liter | 10.00 | 640.00 | 64.00 | View Importer | View Supplier |
18/Mar/2020 | 38249999 | TG218Rep # & TG218 Replenisher plating compound | Korea (Republic) | liter | 10.00 | 640.00 | 64.00 | View Importer | View Supplier |
17/Mar/2020 | 38249999 | MULTIBOND MP REPLENISHER circuit board (20L / CAN), (1-10% sodium hydroxide), 100% new. | Taiwan | cans / can | 25.00 | 5,000.00 | 200.00 | View Importer | View Supplier |
17/Mar/2020 | 38249999 | CM-00118 # & Fillers for IM-GOLD IB REPLENISHER (C6H5K3O7 (H2O): 1%, C6H8O7 (H2O): 1%, C4H6O4: 2%, H2O: 96%) | Japan | liter | 70.00 | 8,454.73 | 120.78 | View Importer | View Supplier |
17/Mar/2020 | 38249999 | CM-00118 # & Fillers for IM-GOLD IB REPLENISHER (C6H5K3O7 (H2O): 1%, C6H8O7 (H2O): 1%, C4H6O4: 2%, H2O: 96%) | Japan | liter | 65.00 | 7,850.82 | 120.78 | View Importer | View Supplier |