| 30/Mar/2020 | 35069900 | 2451882500 HOTMELT M800G thermal glue (Titanium dioxide 4%, Calcium oxide 3%, C5 / C9 petroleum resin 41%, Styrene-butadien rubber series 40%) (17kg / carton). New 100%. | Japan | kg | 2,295.00 | 14,118.20 | 6.15 | View Importer | View Supplier |
| 30/Mar/2020 | 35069900 | 6351997900 HOTMELT M-555-GE thermal glue (Titanium dioxide 1%, Calcium oxide 3%, C5 / C9 petroleum resin 49%, Styrene-butadien rubber series 33%) (17kg / carton). New 100%. | Japan | kg | 765.00 | 4,651.50 | 6.08 | View Importer | View Supplier |
| 28/Mar/2020 | 35030019 | HSV04 # & Glue SA2235-V05 30G-M 30ML-SEMN with Epoxy resin (MW 700), [3- (2,3-epoxypropoxy) propyl] trimethoxysilane (100% new) | Japan | g | 3,000.00 | 9,514.20 | 3.17 | View Importer | View Supplier |
| 28/Mar/2020 | 39073090 | 3001184 # & Silver epoxy glue (EPOP KYOCERA SILVER), TP: Silver, Mixture of epoxy resin and its hardener, 1-Phenoxy-2-propanol, Diethylene glycol n-butylether acetate (CT288-2), 1BT = 10G, 100% new | Japan | g | 200.00 | 534.60 | 2.67 | View Importer | View Supplier |
| 27/Mar/2020 | 35030019 | HSV04 # & Plenset Glue AE-421D, composition Epoxy resin (MW 700), Methylethylketoxime 100% new | Japan | g | 5,600.00 | 18,280.00 | 3.26 | View Importer | View Supplier |
| 27/Mar/2020 | 35061000 | MMEO01 # & Glue (UV curing type resist UVF-10T (KAI)) used to adjust the focus of camera module, Tp mainly Epoxy acrylate resin 35-45%, Acrylic monomer 30-40%, othes. 100% new | Japan | bottle / jar / tube | 2.00 | 20.00 | 10.00 | View Importer | View Supplier |
| 27/Mar/2020 | 35069100 | AS760448 # & UV RESIN Glue (LCR-0635) used to attach cable core (50 gram / pce) | Japan | g | 150.00 | 673.95 | 4.49 | View Importer | View Supplier |
| 27/Mar/2020 | 35069100 | AHD-DB-1137B # & Glue DB-1137B (Thermoplastic rubber 10-20%, Synthetic Resin 10-20%, Carbon black 0-10%, High boiling solvent 10-20%, Methylcyclohexane 20-30%, Ethylacetate 20- 30%), New 100%, M02-73529 | Japan | g | 30,000.00 | 621.00 | 0.02 | View Importer | View Supplier |
| 27/Mar/2020 | 35069900 | NPI-XV6842-197 # & Glue used in camera module manufacturing. Ingredients: Resins, Bisphenol A type, F type, Amine type hardener, silicon dioxide. Manufacturer: Namics Corporation, 100% new. | Japan | g | 1,500.00 | 150.00 | 0.10 | View Importer | View Supplier |
| 27/Mar/2020 | 35069900 | NPI-XV6842-197 # & Glue used in camera module manufacturing. Ingredients: Resins, Bisphenol A type, F type, Amine type hardener, silicon dioxide. Manufacturer: Namics Corporation, 100% new. | Japan | g | 1,120.00 | 112.00 | 0.10 | View Importer | View Supplier |
| 27/Mar/2020 | 35069900 | NPI-XV6842-197 # & Glue used in camera module manufacturing. Ingredients: Resins, Bisphenol A type, F type, Amine type hardener, silicon dioxide. Manufacturer: Namics Corporation, 100% new. | Japan | g | 480.00 | 48.00 | 0.10 | View Importer | View Supplier |
| 27/Mar/2020 | 35069900 | NPI-XV6842-197 # & Glue used in camera module manufacturing. Ingredients: Resins, Bisphenol A type, F type, Amine type hardener, silicon dioxide. Manufacturer: Namics Corporation, 100% new. | Japan | g | 3,600.00 | 360.00 | 0.10 | View Importer | View Supplier |
| 27/Mar/2020 | 35069900 | NW104 # & Bond Glue 7 (Including: ACRYLIC ACID, ALKYL ACRYLATE COPOLYMER 25-30%, HEPTANE 1-5%, HEXANE 1-5%, PHENOL-ALPHA-PINENE RESIN 10-15%, ..., Net weight: 1800G / carton) | Japan | kg | 126.00 | 2,494.80 | 19.80 | View Importer | View Supplier |
| 27/Mar/2020 | 35069900 | SHIV-00000265 # & Glue seal the product crack during processing Three bond TB1206D (250g / tube) (1tuyp = 1chiec) (the composition contains 5% Titanium dioxide and 95% silicon resin) | Japan | piece/pcs | 50.00 | 1,509.96 | 30.20 | View Importer | View Supplier |
| 26/Mar/2020 | 35061000 | Glue-TB.2088E (100g / set) (resin: 80g, hardener: 20g) (brand new 100%) (HSD: 12 months) (used in automotive industry) | Japan | set | 300.00 | 2,050.39 | 6.83 | View Importer | View Supplier |
