| Date | HS Code | Product Description | Origin Country | Unit | Quantity | Total Value [USD] | Unit Price [USD] | Importer Name | Supplier Name |
|---|---|---|---|---|---|---|---|---|---|
| 31/Jan/2019 | 38220090 | Cu-PAN reagent (with Cu-EDTA and PAN components ratio of 11.1: 1) (used for electroplating workshop) | Japan | G | 1.00 | 130.44 | 130.44 | View Importer | View Supplier |
