HS Code - 84248940

Vietnam HS Code 84248940 | HTS Code Wet Processing Equipment, By Projecting, Dispersing Or Spraying, Of Chemical Or Electrochemical Solutions For The Application On Printed Circuit Boards Or Printed Wiring Boards Substrates; Apparatus For The Spot Application Of Liquids, Soldering Pastes, Solder Ball, Adhesives Or Sealant To Printed Circuit Boards Or Printed Wiring Boards Or Their Components; Apparatus For The Application Of Dry Film Or Liquid Photoresist, Photo Sensitive Layers, Soldering Pastes, Solder Or Adhesive Materials On Printed Circuit Boards Or Printed Wiring Boards Substrates Or Their Components

Vietnam HS Code 84248940 is for wet processing equipment, by projecting, dispersing or spraying, of chemical or electrochemical solutions for the application on printed circuit boards or printed wiring boards substrates; apparatus for the spot application of liquids, soldering pastes, solder ball, adhesives or sealant to printed circuit boards or printed wiring boards or their components; apparatus for the application of dry film or liquid photoresist, photo sensitive layers, soldering pastes, solder or adhesive materials on printed circuit boards or printed wiring boards substrates or their components . Lookup 2017 HTS Code or HSN Code.

HS Code Item Description
8424 Mechanical appliances (whether or not handoperated) for projecting, dispersing or spraying liquids or powders; fire extinguishers, whether or not charged; spray guns and similar appliances; steam or sand blasting machines and similar jet projecting machines.
842489 Other:
84248940 Wet processing equipment, by projecting, dispersing or spraying, of chemical or electrochemical solutions for the application on printed circuit boards or printed wiring boards substrates; apparatus for the spot application of liquids, soldering pastes, solder ball, adhesives or sealant to printed circuit boards or printed wiring boards or their components; apparatus for the application of dry film or liquid photoresist, photo sensitive layers, soldering pastes, solder or adhesive materials on printed circuit boards or printed wiring boards substrates or their components