| Date | HS Code | Product Description | Destination Country | Unit | Quantity | Total Value [USD] | Unit Price [USD] | Importer Name | Supplier Name |
|---|---|---|---|---|---|---|---|---|---|
| 31/Mar/2020 | 85423900 | Integrated electronic circuit model: BES3001-SP, parameter: BGA 48-Ball, manufacturer of BES, used in manufacturing and assembling the phone headphone board. 100% new goods # & CN | China | pcs/piece | 18,000.00 | 7,380.00 | 0.41 | View Importer | View Supplier |
| 16/Mar/2020 | 85423900 | Integrated electronic circuit model: BES3001-SP, parameter: BGA 48-Ball, manufacturer of BES, used in manufacturing and assembling the phone headphone board. 100% new goods # & CN | China | pcs/piece | 9,000.00 | 3,690.00 | 0.41 | View Importer | View Supplier |
| 10/Mar/2020 | 85423900 | HAAAB-00174 (EP2020) # & Printed circuit board model: HAAAB-00174 (K0.4) used for assembling and manufacturing mobile phone headsets. New 100% # & VN | China | pcs/piece | 90,000.00 | 139,222.80 | 1.55 | View Importer | View Supplier |
