31/Mar/2020 | 85423900 | Integrated electronic circuit model: BES3001-SP, parameter: BGA 48-Ball, manufacturer of BES, used in manufacturing and assembling the phone headphone board. 100% new goods # & CN | China | pcs/piece | 18,000.00 | 7,380.00 | 0.41 | View Importer | View Supplier |
16/Mar/2020 | 85423900 | Integrated electronic circuit model: BES3001-SP, parameter: BGA 48-Ball, manufacturer of BES, used in manufacturing and assembling the phone headphone board. 100% new goods # & CN | China | pcs/piece | 9,000.00 | 3,690.00 | 0.41 | View Importer | View Supplier |
16/Mar/2020 | 85423900 | Integrated electronic circuit model: IC RTC6226, parameters: 62 ~ 110MH, 2.0 ~ 3.6V.kt: 2 * 2mm, manufacturer: Richwave used to produce and assemble the phone headphone board. 100% new goods # & TW | China | pcs/piece | 9,000.00 | 1,852.20 | 0.21 | View Importer | View Supplier |