| 17/Mar/2020 | 85429000 | SHG89XA40001 # & Semiconductor chip used in semiconductor chip manufacturing technology (WAFER), 200um (+ -) 10um thick, CSP stage, SHG89XA40001 returned part 3 of the product line 3 TK 103172945520 / E11 on February 28, 2020 # & KR | Korea (Republic) | pcs/piece | 91,819.00 | 1,101.83 | 0.01 | View Importer | View Supplier |
| 17/Mar/2020 | 85429000 | SHG56BA00001 # & Semiconductor chips used in the technology of manufacturing semiconductor chips (WAFER) with a thickness of 200um (+ -) 10um, stage CSP, SHG56BA00001 returned part of the line 4 TK 103172945520 / E11 on February 28, 2020 # & KR | Korea (Republic) | pcs/piece | 39,117.00 | 391.17 | 0.01 | View Importer | View Supplier |
| 17/Mar/2020 | 85429000 | SWG42EPM0H01 # & Semiconductor chips used in semiconductor chip manufacturing (WAFER) technology, 200um (+ -) 10um thick; stages CSP, SWG42EPM0H01 return part of the product line 7 TK 103192873010 / E11 on October 10, 2020 # & KR | Korea (Republic) | pcs/piece | 181,464.00 | 5,080.99 | 0.03 | View Importer | View Supplier |
| 10/Mar/2020 | 85429000 | BLK-CS # & In-circuit spacer__ 18th line, declaration No. 103186269800 March 6, 2020 # & JP | Japan | pcs/piece | 1.00 | 274.15 | 274.15 | View Importer | View Supplier |
| 05/Mar/2020 | 85429000 | B0090.7 # & CONTROLLER PART-CONTROLLER GOODS-Parts for the controller. Re-export item 1 in declaration 103098629101 dated January 9, 2020. #&VN | Japan | pcs/piece | 1,237.00 | 23,028.61 | 18.62 | View Importer | View Supplier |
