| 27/Mar/2020 | 38159000 | MM04-004895 # & HAVING ANSWERS HVF ACTIVATOR H1 (CONTAINS PALLADIUM (II) SULFATE <1%, BORIC ACID <1%), INCREASE SPEED | Korea (Republic) | liter | 200.00 | 15,556.00 | 77.78 | View Importer | View Supplier |
| 26/Mar/2020 | 34029019 | R2004006-006362 # & Ultrasonic degreaser in CLEAN-300 (N) resin, 200 liters / phi.TP: Boric acid, sodium salt, pentahydrate; Alcohols, C12-14, ethoxylated propoxylated; 100% new | Vietnam | liter | 200.00 | 298.00 | 1.49 | View Importer | View Supplier |
| 26/Mar/2020 | 34029019 | R2004006-006362 # & Ultrasonic degreaser in CLEAN-300 (N) resin, 200 liters / phi.TP: Boric acid, sodium salt, pentahydrate; Alcohols, C12-14, ethoxylated propoxylated; 100% new | Vietnam | liter | 4,600.00 | 6,808.00 | 1.48 | View Importer | View Supplier |
| 26/Mar/2020 | 34029019 | R2004006-001690 # & Ultrasonic degreaser in plastic CAN-300 (N), 20 liters / can.TP: Boric acid, sodium salt, pentahydrate; Alcohols, C12-14, ethoxylated propoxylated; 100% new | Vietnam | liter | 16,760.00 | 18,603.60 | 1.11 | View Importer | View Supplier |
| 25/Mar/2020 | 34029019 | R2004006-001690 # & CLEAN-300 (N) (Ultrasonic oily surface cleaner in resins, 20lit / can) (TP: Boric acid, sodium salt, pentahydrate 3-4%; Sodium tripolyphosphate 3-6% ...) (New 100%) | Vietnam | liter | 1,800.00 | 2,016.00 | 1.12 | View Importer | View Supplier |
| 25/Mar/2020 | 3824999990 | 0 # & HVF Activator H1. Copper plating pretreatment solution containing <1% Palladium (II) sulfate, <1% Boric acid. New 100% | Korea (Republic) | liter | 200.00 | 21,051.12 | 105.26 | View Importer | View Supplier |
| 24/Mar/2020 | 28100000 | CIRCUPOSIT (TM) 6540B REDUCER has 90-99% water and 1 - 10% boric acid, which smooths the surface of the board's copper layer. Used in electronic circuit manufacturing technology. | China | liter | 1,000.00 | 2,110.05 | 2.11 | View Importer | View Supplier |
| 24/Mar/2020 | 28100000 | CM-00044 # & CIRCUPOSIT (TM) 6540B REDUCER contains water 90-99% and boric acid H3BO3 1 - 10% has the effect of smoothing the surface of the copper layer of the circuit board. | China | liter | 120.00 | 318.00 | 2.65 | View Importer | View Supplier |
| 18/Mar/2020 | 38140000 | VAPOUR FLUX BL-5 (CH3O) 3B + CH3OH (20L) solvent (used to support the welding process) (METHANOL: 36-42% + TRIMETHYLE BORIC ACID: 58-64%) | Japan | liter | 160.00 | 1,579.86 | 9.87 | View Importer | View Supplier |
| 17/Mar/2020 | 34029019 | R2004006-006362 # & Ultrasonic degreaser in CLEAN-300 (N) resin, 200 liters / phi.TP: Boric acid, sodium salt, pentahydrate; Alcohols, C12-14, ethoxylated propoxylated; 100% new | Vietnam | liter | 1,600.00 | 2,384.00 | 1.49 | View Importer | View Supplier |
| 17/Mar/2020 | 34029019 | R2004006-001690 # & Ultrasonic degreaser in plastic CAN-300 (N), 20 liters / can.TP: Boric acid, sodium salt, pentahydrate; Alcohols, C12-14, ethoxylated propoxylated; 100% new | Vietnam | liter | 4,700.00 | 5,217.00 | 1.11 | View Importer | View Supplier |
| 17/Mar/2020 | 3824999990 | 0 # & HVF Activator H1. Copper plating pretreatment solution containing <1% Palladium (II) sulfate, <1% Boric acid. New 100% | Korea (Republic) | liter | 200.00 | 21,242.29 | 106.21 | View Importer | View Supplier |
| 14/Mar/2020 | 38159000 | MM04-004895 # & HAVING ANSWERS HVF ACTIVATOR H1 (CONTAINS PALLADIUM (II) SULFATE <1%, BORIC ACID <1%), INCREASE SPEED | Korea (Republic) | liter | 400.00 | 31,112.00 | 77.78 | View Importer | View Supplier |
| 13/Mar/2020 | 34029019 | HVF Activator H1. Copper plating pretreatment solution containing <1% Palladium (II) sulfate, <1% Boric acid, packed 20l / can. New 100% | Korea (Republic) | liter | 700.00 | 56,847.00 | 81.21 | View Importer | View Supplier |
| 13/Mar/2020 | 3824999990 | 0 # & HVF Activator H1. Copper plating pretreatment solution containing <1% Palladium (II) sulfate, <1% Boric acid. New 100% | Korea (Republic) | liter | 200.00 | 18,383.67 | 91.92 | View Importer | View Supplier |
