| 16/Mar/2020 | 35061000 | BZKP000039 # & GLUE EPOXY (HT-1330MTM), 300gam / 1 pc. Ingredients Bisphenol F Diglycidyl Ether (Epoxy Resin) 50-70%; Amine Adduct 10-20%; Fumed Silica and Talc 20-30%; Organic Pigment 1-6% | Korea (Republic) | piece/pcs | 10.00 | 650.00 | 65.00 | View Importer | View Supplier |
| 11/Mar/2020 | 35061000 | Glue for electronic components 2012-1 HF 10cc / vial (including: Silica 50-60%, Bisphenol F Diglycidyl Ether (Epoxy Resin) 30-40%, Amine Adduct 3-7%, ..). 100% new | Korea (Republic) | bottle / jar / tube | 30.00 | 577.80 | 19.26 | View Importer | View Supplier |
| 04/Mar/2020 | 35061000 | HT-130DL-1 Chip Adhesives (ingredients: Bisphenol F Diglycidyl Ether 54208-63-8, Amine Adduct 134091-76-2, Fumed Silica 67762-90-7, Organic Pigment 5280-66-0), 300g / bottle , manufacturer: Hi-Tech Korea, 100% new | Korea (Republic) | piece/pcs | 1.00 | 70.69 | 70.69 | View Importer | View Supplier |
| 17/Jan/2019 | 35061000 | EPOXY GLUE (HT-1330MTM) , 300gam / 1 pc. Ingredients Bisphenol F Diglycidyl Ether (Epoxy Resin) 50-70%; Amine Adduct 10-20%; Fumed Silica and Talc 20-30%; Organic Pigment 1-6%. | Korea (Republic) | Piece/Pcs | 10.00 | 650.00 | 65.00 | View Importer | View Supplier |
