| 31/Mar/2020 | 35069900 | AVTC42-01 # & Adhesive POLYMER adhesive, brand new 100%, ERP: 194799001270 | China | g | 60,000.00 | 2,164.80 | 0.04 | View Importer | View Supplier |
| 30/Mar/2020 | 35069900 | 5CHJ00184A # & Adhesive components (SA2201DN-30G), components include: Bisphenol F type epoxy resin (liquid), Synthetic Resins, Bisphenol A type Epoxy Resin, Silica, Polymerization initiators. (1CC = 1G) .New 100% | Japan | g | 6,000.00 | 21,873.60 | 3.65 | View Importer | View Supplier |
| 27/Mar/2020 | 35069900 | 5300KE0079A-H # & Adhesive components (LE4869-M4) used to produce camera modules, without precursors, manufacturer: Ace Polymer, 100% New | United States of America | g | 5,400.00 | 14,904.00 | 2.76 | View Importer | View Supplier |
| 25/Mar/2020 | 35069900 | 5REZ00031A # & Adhesive components (SDD-100), including HYDROFLUOROETHER (80%), M-ENEHEXAFLUORIDE (10%), ACRYL POLYMER (10%), no precursors, 100% new. | Japan | g | 12,000.00 | 2,652.00 | 0.22 | View Importer | View Supplier |
| 24/Mar/2020 | 35069900 | 5300KE0079A-H # & Adhesive components (LE4869-M4) used to produce camera modules, without precursors, manufacturer: Ace Polymer, 100% New | United States of America | g | 10,800.00 | 29,808.00 | 2.76 | View Importer | View Supplier |
| 23/Mar/2020 | 35069900 | 5CHJ00184A # & Adhesive components (SA2201DN-30G), components include: Bisphenol F type epoxy resin (liquid), Synthetic Resins, Bisphenol A type Epoxy Resin, Silica, Polymerization initiators. (1CC = 1G) .New 100% | Japan | g | 6,000.00 | 21,873.60 | 3.65 | View Importer | View Supplier |
| 18/Mar/2020 | 35069900 | SEV006 # & CEMEDINE-SX720WH + Adhesive (ingredients: Silica, tetraethyl orthosilicate; Silicone modified polymer; Fillers; Paraffin; Organic tin compund) | Japan | g | 5,000.00 | 392.20 | 0.08 | View Importer | View Supplier |
| 13/Mar/2020 | 35069900 | 5REZ00031A # & Adhesive components (SDD-100), including HYDROFLUOROETHER (80%), M-ENEHEXAFLUORIDE (10%), ACRYL POLYMER (10%), no precursors, 100% new. | Japan | g | 12,000.00 | 2,652.00 | 0.22 | View Importer | View Supplier |
| 13/Mar/2020 | 35069900 | 5CHJ00184A # & Adhesive components (SA2201DN-30G), components include: Bisphenol F type epoxy resin (liquid), Synthetic Resins, Bisphenol A type Epoxy Resin, Silica, Polymerization initiators. (1CC = 1G) .New 100% | Japan | g | 3,750.00 | 13,671.00 | 3.65 | View Importer | View Supplier |
| 09/Mar/2020 | 35069900 | 5300KE0079A-H # & Adhesive components (LE4869-M4) used to produce camera modules, without precursors, manufacturer: Ace Polymer, 100% New | United States of America | g | 5,400.00 | 14,904.00 | 2.76 | View Importer | View Supplier |
| 06/Mar/2020 | 35069900 | 5CHJ00184A # & Adhesive components (SA2201DN-30G), components include: Bisphenol F type epoxy resin (liquid), Synthetic Resins, Bisphenol A type Epoxy Resin, Silica, Polymerization initiators. (1CC = 1G) .New 100% | Japan | g | 3,750.00 | 13,671.00 | 3.65 | View Importer | View Supplier |
| 03/Mar/2020 | 35069900 | 5REZ00031A # & Adhesive components (SDD-100), including HYDROFLUOROETHER (80%), M-ENEHEXAFLUORIDE (10%), ACRYL POLYMER (10%), no precursors, 100% new. | Japan | g | 12,000.00 | 2,652.00 | 0.22 | View Importer | View Supplier |
| 02/Mar/2020 | 35069900 | 5CHJ00184A # & Adhesive components (SA2201DN-30G), components include: Bisphenol F type epoxy resin (liquid), Synthetic Resins, Bisphenol A type Epoxy Resin, Silica, Polymerization initiators. (1CC = 1G) .New 100% | Japan | g | 5,250.00 | 19,139.40 | 3.65 | View Importer | View Supplier |
| 02/Mar/2020 | 35069900 | 5300KE0079A-H # & Adhesive components (LE4869-M4) used to produce camera modules, without precursors, manufacturer: Ace Polymer, 100% New | United States of America | g | 5,400.00 | 14,904.00 | 2.76 | View Importer | View Supplier |
| 30/Jan/2019 | 35069900 | VT53 # & MF4055 Prepared Adhesive for gluing phone speakers , made of vinyl polymer. | Korea (Republic) | G | 13,000.00 | 5,828.20 | 0.45 | View Importer | View Supplier |
