| 16/Mar/2020 | 35061000 | BZKP000039 # & GLUE EPOXY (HT-1330MTM), 300gam / 1 pc. Ingredients Bisphenol F Diglycidyl Ether (Epoxy Resin) 50-70%; Amine Adduct 10-20%; Fumed Silica and Talc 20-30%; Organic Pigment 1-6% | Korea (Republic) | piece/pcs | 10.00 | 650.00 | 65.00 | View Importer | View Supplier |
| 29/Jan/2019 | 35061000 | 2360012B # & Loctite UF 3808 Industrial Adhesives , 100% new products, packing 50ML / Tube (Ingredients: Epoxy resin and oxirane) | China | Bottle/Jar/Tube | 500.00 | 37,500.00 | 75.00 | View Importer | View Supplier |
| 24/Jan/2019 | 35061000 | Silicon glue , made from pure silicon and additives, catalysts (including pigments , fillers , resins) New 100%. | Vietnam | Bottle/Jar/Tube | 10.00 | 28.37 | 2.84 | View Importer | View Supplier |
| 18/Jan/2019 | 35061000 | BOND electronic component mounting glue (50400-1) TP: epoxy resin: 35-42% , filler: 34-42% , 4 , 4 '- (1-methylethylidene) bisphenol and (chloromethyl) oxirane Polymer : 3-9% , glycidol: 2-9% , carbon black: 0.1-1% | China | Bottle/Jar/Tube | 40.00 | 1,104.00 | 27.60 | View Importer | View Supplier |
| 17/Jan/2019 | 35061000 | 2360012B # & Loctite UF 3808 Industrial Adhesives , 100% new products, packing 50ML / Tube (Ingredients: Epoxy resin and oxirane) | China | Bottle/Jar/Tube | 600.00 | 45,000.00 | 75.00 | View Importer | View Supplier |
| 17/Jan/2019 | 35061000 | BOND electronic component mounting glue (50400-1) TP: epoxy resin: 35-42% , filler: 34-42% , 4 , 4 '- (1-methylethylidene) bisphenol and (chloromethyl) oxirane Polymer : 3-9% , glycidol: 2-9% , carbon black: 0.1-1% | China | Bottle/Jar/Tube | 30.00 | 828.00 | 27.60 | View Importer | View Supplier |
| 17/Jan/2019 | 35061000 | EPOXY GLUE (HT-1330MTM) , 300gam / 1 pc. Ingredients Bisphenol F Diglycidyl Ether (Epoxy Resin) 50-70%; Amine Adduct 10-20%; Fumed Silica and Talc 20-30%; Organic Pigment 1-6%. | Korea (Republic) | Piece/Pcs | 10.00 | 650.00 | 65.00 | View Importer | View Supplier |
| 10/Jan/2019 | 35061000 | ARALDITE HY GLUE ADHESIVE 2012 (1EA = 20 X 6 X 50ML) MAIN COMPONENTS: EPOXY RESIN , AVIATION UNDER PRIORITY LIST , CHEMICALS MUST BE DECLARED UNDER DECREE 73/2018 / ND-CP AND DECREE 113 / 2017 / ND-CP | United Kingdom | Box/Packet/Crate | 1.00 | 1,617.70 | 1,617.70 | View Importer | View Supplier |
| 05/Jan/2019 | 35061000 | BOND electronic component mounting glue (50400-1) TP: epoxy resin: 35-42% , filler: 34-42% , 4 , 4 '- (1-methylethylidene) bisphenol and (chloromethyl) oxirane Polymer : 3-9% , glycidol: 2-9% , carbon black: 0.1-1% | China | Bottle/Jar/Tube | 80.00 | 2,208.00 | 27.60 | View Importer | View Supplier |
| 03/Jan/2019 | 35061000 | Adhesive used in manufacturing AF-8400 50cc (Epoxy resin 25068-38-6 , Curing Agent (Amines and Thiols) , Carbon black 1333-86-4) , NW 14UNA / 4KG. 100% brand new | Korea (Republic) | Bottle/Jar/Tube | 14.00 | 1,179.08 | 84.22 | View Importer | View Supplier |
| 03/Jan/2019 | 35061000 | Adhesive used in manufacturing DFM-6130 10cc (Epoxy resin 9003-36-5 , Epoxy resin 9003-36-5 , Epoxy resin 9003-36-5 , Curing Agent (Amines and Thiols) , Carbon black 1333 -86-4) NW 15UNA / 1KG. 100% new goods | Korea (Republic) | Bottle/Jar/Tube | 15.00 | 258.15 | 17.21 | View Importer | View Supplier |
