| 28/Mar/2020 | 39073090 | 3001184 # & Silver epoxy glue (EPOP KYOCERA SILVER), TP: Silver, Mixture of epoxy resin and its hardener, 1-Phenoxy-2-propanol, Diethylene glycol n-butylether acetate (CT288-2), 1BT = 10G, 100% new | Japan | g | 200.00 | 534.60 | 2.67 | View Importer | View Supplier |
| 12/Mar/2020 | 39073090 | 3001189 # & Epoxy Glue EPOP PASTE (ECCOBOND / S-3860C /: E&C) 1 PCE = 10g. Tp include: Trade secret resin, Modified epoxy resin, C2H6O (CAS: 64-17-5), C15H24O (CAS: 128-37-0) and additives. New 100% | Japan | g | 600.00 | 3,419.29 | 5.70 | View Importer | View Supplier |
| 12/Mar/2020 | 39073090 | 3006733 # & Epoxy Glue EPOP ECOBOND / S-3869 / (BT = 5CC / 5G), tp include: Proprietary Resin, TiO2, Modified epoxy resin, C2H6O, SiO2, C15H24O, Mineral oil and additives. 100% new. | Japan | g | 200.00 | 1,438.80 | 7.19 | View Importer | View Supplier |
| 09/Jan/2019 | 39069099 | KVP0175 # & Crystal resin anti-discharge between circuit board and nut (from acrylic resin). 100% new goods | Japan | G | 100.00 | 7,326.22 | 73.26 | View Importer | View Supplier |
