28/Mar/2020 | 39073090 | 3001184 # & Silver epoxy glue (EPOP KYOCERA SILVER), TP: Silver, Mixture of epoxy resin and its hardener, 1-Phenoxy-2-propanol, Diethylene glycol n-butylether acetate (CT288-2), 1BT = 10G, 100% new | Japan | g | 200.00 | 534.60 | 2.67 | View Importer | View Supplier |
12/Mar/2020 | 39073090 | 3001189 # & Epoxy Glue EPOP PASTE (ECCOBOND / S-3860C /: E&C) 1 PCE = 10g. Tp include: Trade secret resin, Modified epoxy resin, C2H6O (CAS: 64-17-5), C15H24O (CAS: 128-37-0) and additives. New 100% | Japan | g | 600.00 | 3,419.29 | 5.70 | View Importer | View Supplier |
12/Mar/2020 | 39073090 | 3006733 # & Epoxy Glue EPOP ECOBOND / S-3869 / (BT = 5CC / 5G), tp include: Proprietary Resin, TiO2, Modified epoxy resin, C2H6O, SiO2, C15H24O, Mineral oil and additives. 100% new. | Japan | g | 200.00 | 1,438.80 | 7.19 | View Importer | View Supplier |
12/Mar/2020 | 39073090 | Epoxide resin (EME) EME-G311EB, size: 16mm 6.0g, used to cover and protect the chip in the manufacture of electronic components. New 100%. | Japan | kg | 3.00 | 54.73 | 18.24 | View Importer | View Supplier |
12/Mar/2020 | 39073090 | Epoxide resin (EME) EME-G311L, size: 16mm 6.0g, used to cover and protect the chip in the production of electronic components. New 100%. | Japan | kg | 3.00 | 54.73 | 18.24 | View Importer | View Supplier |