| 28/Mar/2020 | 71069200 | A08G05-100 # & Welding materials (bonding components and ensuring air tightness) in silver alloy wire form, KT: 0.5mmx0.07mmx100m, 05-100 | Japan | m | 400.00 | 476.00 | 1.19 | View Importer | View Supplier |
| 28/Mar/2020 | 71069200 | A08G05-100 # & Welding materials (bonding components and ensuring air tightness) in silver alloy wire form, KT: 0.5mmx0.07mmx100m, 05-100 | Japan | m | 400.00 | 448.00 | 1.12 | View Importer | View Supplier |
| 27/Mar/2020 | 71069200 | DM1019 # & Solder wire for electronic component bonding / Solder-EUD-S611-0473 / 0.05-2.0 | Japan | m | 600.00 | 6,108.00 | 10.18 | View Importer | View Supplier |
| 26/Mar/2020 | 71081300 | DM999 # & Soldering balls used to bond electronic components / Ausn solder -HDI563A34 | Japan | piece/pcs | 112,450.00 | 60,723.00 | 0.54 | View Importer | View Supplier |
| 25/Mar/2020 | 71159090 | DM992 # & Soldering balls used for bonding electronic components / AuSn Solder-PSP080008 / 0.5X0.5-0.1NA | Japan | piece/pcs | 30,000.00 | 600.00 | 0.02 | View Importer | View Supplier |
| 18/Mar/2020 | 71159010 | Gold wire for bonding Light-emitting diodes, used in the production line of PKG, Wire Au 1.0mil, 99.99% gold content, 100% New Product (RG00001-1) | Korea (Republic) | m | 90,000.00 | 34,398.00 | 0.38 | View Importer | View Supplier |
| 18/Mar/2020 | 71159090 | DM1014 # & Soldering balls used for bonding electronic components / AuSn Ball-PSP080007 / 0.45 | Japan | piece/pcs | 150,000.00 | 6,000.00 | 0.04 | View Importer | View Supplier |
| 11/Mar/2020 | 71051000 | DIAMOND DIAMOND POWDER, 6-12MICROOM, METAL BOND, 34% TINI COATED | United States of America | carats | 10,000.00 | 284.00 | 0.03 | View Importer | View Supplier |
| 11/Mar/2020 | 71081290 | 3 # & 20-wire AU WIRE (Bonding wire) 20 micron GFC TYPE1.0-7.0% 5.0-9.9G 2000M / AL-4 | Malaysia | roll | 44.00 | 27,688.32 | 629.28 | View Importer | View Supplier |
| 06/Mar/2020 | 71069200 | A08G05-100 # & Welding materials (bonding components and ensuring air tightness) in silver alloy wire form, KT: 0.5mmx0.07mmx100m, 05-100 | Japan | m | 1,200.00 | 1,284.00 | 1.07 | View Importer | View Supplier |
| 06/Mar/2020 | 71069200 | A08G05-100 # & Welding materials (bonding components and ensuring air tightness) in silver alloy wire form, KT: 0.5mmx0.07mmx100m, 05-100 | Japan | m | 1,200.00 | 1,356.00 | 1.13 | View Importer | View Supplier |
| 06/Mar/2020 | 71069200 | A08G05-100 # & Welding materials (bonding components and ensuring air tightness) in silver alloy wire form, KT: 0.5mmx0.07mmx100m, 05-100 | Japan | m | 1,200.00 | 1,332.00 | 1.11 | View Importer | View Supplier |
| 06/Mar/2020 | 71159090 | DM1007 # & Soldering balls used to bond electronic components / AuSn Ball-PSP080007 / 0.4 | Japan | piece/pcs | 50,000.00 | 1,500.00 | 0.03 | View Importer | View Supplier |
| 06/Mar/2020 | 71159090 | DM992 # & Soldering balls used for bonding electronic components / AuSn Solder-PSP080008 / 0.5X0.5-0.1NA | Japan | piece/pcs | 50,000.00 | 1,000.00 | 0.02 | View Importer | View Supplier |
| 03/Mar/2020 | 71129990 | MCCSM0018108490001-M # & Soldering strands Micro Gold mobile phone accessories (GOLD BONDING WIRE (HP0.8Mil)) | Korea (Republic) | m | 30,480.00 | 11,878.05 | 0.39 | View Importer | View Supplier |
