| Date | HS Code | Product Description | Origin Country | Unit | Quantity | Total Value [USD] | Unit Price [USD] | Importer Name | Supplier Name |
|---|---|---|---|---|---|---|---|---|---|
| 09/Mar/2020 | 80012000 | SOLDER PASTE (GSP) # & Tin-silver-copper-GSP alloys (500G / JAR) (MOQ: 40) (unleaded), paste, flux, used to solder electrical circuits (0.5kg / jar ). GD No. 0424 / TĐ-N1-08, 100% new | Japan | kg | 50.00 | 4,926.14 | 98.52 | View Importer | View Supplier |
