| 30/Mar/2020 | 38249999 | CIRCUPOSIT 6530 CAT (VN) / 20L without water> 98%, Inorganic salt <1%. Has the effect of promoting the formation of copper layer inside the hole of the board. Used in electronic circuit manufacturing technology | Japan | liter | 1,280.00 | 52,313.67 | 40.87 | View Importer | View Supplier |
| 30/Mar/2020 | 38249999 | CIRCUPOSIT P-6550M (VN) / 20L without water 75 - 85% and Organic salt 15 - 25%. Has the effect of improving adhesion and surface quality of products. Used in electronic circuit manufacturing technology. | Japan | liter | 1,280.00 | 9,157.80 | 7.15 | View Importer | View Supplier |
| 24/Mar/2020 | 38249999 | CIRCUPOSIT P-6550C (VN) / 20L without water 70 -80% and Organic salt 20 - 30%. Has the effect of improving adhesion and surface quality of products. Used in electronic circuit manufacturing technology. | Japan | liter | 640.00 | 4,622.06 | 7.22 | View Importer | View Supplier |
| 24/Mar/2020 | 38249999 | CIRCUPOSIT P-6550M (VN) / 20L without water 75 - 85% and Organic salt 15 - 25%. Has the effect of improving adhesion and surface quality of products. Used in electronic circuit manufacturing technology. | Japan | liter | 1,280.00 | 8,759.36 | 6.84 | View Importer | View Supplier |
| 20/Mar/2020 | 38249999 | CIRCUPOSIT P-6550A ELESS CU / 20L water-resistant 80-90%, Copper sulfate 10-20%, Sulfuric acid <1%. Effect of improving adhesion and surface quality of products. Used in electronic circuit manufacturing technology | Taiwan | liter | 6,000.00 | 21,127.54 | 3.52 | View Importer | View Supplier |
| 16/Mar/2020 | 38249999 | CIRCUPOSIT P-6550A ELESS CU / 20L without water 80-90%, Copper sulfate 10-20%, Sulfuric acid <1%. Has the effect of improving the adhesion and surface quality of the product. Used in electronics manufacturing technology | Taiwan | liter | 9,000.00 | 31,753.76 | 3.53 | View Importer | View Supplier |
| 30/Jan/2019 | 38249999 | CIRCUPOSIT 6530 CAT (VN) / 20L without water> 98% and Inorganic salt <1%. It helps to promote the process of forming the copper layer inside the hole of the board. In electronic circuit manufacturing technology | Japan | Lit | 1,280.00 | 51,013.10 | 39.85 | View Importer | View Supplier |
| 30/Jan/2019 | 38249999 | CIRCUPOSIT P-6550M (VN) / 20L without water 75 - 85% and Organic salt 15 - 25%. Has the effect of improving adhesion and surface quality of products. Used in electronic board manufacturing technology. | Japan | Lit | 1,100.00 | 7,091.95 | 6.45 | View Importer | View Supplier |
| 21/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT (TM) 6540A REDUCER solution smooths the surface of the board's copper layer. Used in electronic circuit manufacturing technology (containing 90-99% water and (CH3) 2NH.BH3: 1-10%) | China | Lit | 320.00 | 5,788.80 | 18.09 | View Importer | View Supplier |
| 21/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT 6540C REDUCER / 20L solution (contains 70-80% water and Acetic acid 20-30%) , which enhances nickel plating speed , surface quality sp, used in boron manufacturing technology electronic circuit | China | Lit | 100.00 | 590.00 | 5.90 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | CIRCUPOSIT 6530 CAT (VN) / 20L without water> 98% and Inorganic salt <1%. It helps to promote the process of forming the copper layer inside the hole of the board. In electronic circuit manufacturing technology | Japan | Lit | 400.00 | 15,779.37 | 39.45 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | CIRCUPOSIT P-6550C (VN) / 20L without water 70 -80% and Organic salt 20 - 30%. Has the effect of improving adhesion and surface quality of products. Used in electronic board manufacturing technology. | Japan | Lit | 320.00 | 2,134.74 | 6.67 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | CIRCUPOSIT P-6550M (VN) / 20L without water 75 - 85% and Organic salt 15 - 25%. Has the effect of improving adhesion and surface quality of products. Used in electronic board manufacturing technology. | Japan | Lit | 3,200.00 | 19,965.44 | 6.24 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | CUPOSIT N (VN) / 20L without water 85-95% , Nickel sulfate 1-10% , and Sulfuric acid 1-10%. Has the effect of improving adhesion and surface quality of products. Used in electronic circuit manufacturing technology | Japan | Lit | 320.00 | 3,252.23 | 10.16 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | CIRCUPOSIT (TM) 6540A REDUCER 90-99% water and Dimethylamine borane 1- 10% have the effect of smoothing the surface of the board's copper layer. Used in electronic board manufacturing technology. | China | Lit | 300.00 | 4,136.40 | 13.79 | View Importer | View Supplier |
