| 13/Mar/2020 | 35069900 | # & Finished product adhesive Allied Silitec to dust electronic components (3,785 liters / can). Ingredients: Butyl acetate, Ethyl acetate, Vinyl resin. New 100% | United States of America | cans / can | 8.00 | 2,440.00 | 305.00 | View Importer | View Supplier |
| 29/Jan/2019 | 35069900 | Thermal paste for manufacturing electronic circuit boards GAP FILLER 3500LV contains: Aluminum oxide 5 mg / m3 , CI Pigment blue 28 0.02 mg / m3. New 100% | United States of America | G | 70,400.00 | 5,491.20 | 0.08 | View Importer | View Supplier |
| 24/Jan/2019 | 35069900 | LOCTITE SF 7649 CAN electronic component adhesive (1 GAL / box) includes: Acetone , 2-ethylhexanoic acid , copper salt) | United States of America | Bottle/Jar/Tube | 4.00 | 1,500.00 | 375.00 | View Importer | View Supplier |
| 21/Jan/2019 | 35069900 | LOCTITE 3103 UV (1L / box) electronic component adhesives include: Isobornyl acrylate , Hydroxyethyl methacrylate , Camphene , Methacrylic acid , Hydroxyethyl acrylate , Ethanone , dimethoxy , diphenyl) | United States of America | Bottle/Jar/Tube | 3.00 | 801.48 | 267.16 | View Importer | View Supplier |
