| 30/Jan/2019 | 38249999 | CIRCUPOSIT 6530 CAT (VN) / 20L without water> 98% and Inorganic salt <1%. It helps to promote the process of forming the copper layer inside the hole of the board. In electronic circuit manufacturing technology | Japan | Lit | 1,280.00 | 51,013.10 | 39.85 | View Importer | View Supplier |
| 30/Jan/2019 | 38249999 | CIRCUPOSIT P-6550M (VN) / 20L without water 75 - 85% and Organic salt 15 - 25%. Has the effect of improving adhesion and surface quality of products. Used in electronic board manufacturing technology. | Japan | Lit | 1,100.00 | 7,091.95 | 6.45 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT 6530 CATALYST solution contains> 98% water and Inorganic salt <1% , which promotes the formation of copper layer in the motherboard hole wall , used in electronic board manufacturing | Japan | Lit | 160.00 | 8,528.00 | 53.30 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT 6530 CATALYST solution contains> 98% water and Inorganic salt <1% , which promotes the formation of copper layer in the motherboard hole wall , used in electronic board manufacturing | Japan | Lit | 40.00 | 2,132.00 | 53.30 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT P-6550C ELECTROLESS COPPER Organic Salt 20-30% , water 70-80% , which improve the adhesion and surface quality of products , in electronic circuit boards manufacturing | Japan | Lit | 200.00 | 1,800.00 | 9.00 | View Importer | View Supplier |
| 21/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT 6530 CATALYST solution contains> 98% water and Inorganic salt <1% , which promotes the formation of copper layer in the motherboard hole wall , used in electronic board manufacturing | Japan | Lit | 500.00 | 26,650.00 | 53.30 | View Importer | View Supplier |
| 21/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT (TM) 6540A REDUCER solution smooths the surface of the board's copper layer. Used in electronic circuit manufacturing technology (containing 90-99% water and (CH3) 2NH.BH3: 1-10%) | China | Lit | 320.00 | 5,788.80 | 18.09 | View Importer | View Supplier |
| 21/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT P-6550C ELECTROLESS COPPER Organic Salt 20-30% , water 70-80% , which improve the adhesion and surface quality of products , in electronic circuit boards manufacturing | Japan | Lit | 320.00 | 2,880.00 | 9.00 | View Importer | View Supplier |
| 21/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT 6540C REDUCER / 20L solution (contains 70-80% water and Acetic acid 20-30%) , which enhances nickel plating speed , surface quality sp, used in boron manufacturing technology electronic circuit | China | Lit | 100.00 | 590.00 | 5.90 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | CIRCUPOSIT 6530 CAT (VN) / 20L without water> 98% and Inorganic salt <1%. It helps to promote the process of forming the copper layer inside the hole of the board. In electronic circuit manufacturing technology | Japan | Lit | 400.00 | 15,779.37 | 39.45 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | CIRCUPOSIT P-6550C (VN) / 20L without water 70 -80% and Organic salt 20 - 30%. Has the effect of improving adhesion and surface quality of products. Used in electronic board manufacturing technology. | Japan | Lit | 320.00 | 2,134.74 | 6.67 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | CIRCUPOSIT P-6550M (VN) / 20L without water 75 - 85% and Organic salt 15 - 25%. Has the effect of improving adhesion and surface quality of products. Used in electronic board manufacturing technology. | Japan | Lit | 3,200.00 | 19,965.44 | 6.24 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | CUPOSIT N (VN) / 20L without water 85-95% , Nickel sulfate 1-10% , and Sulfuric acid 1-10%. Has the effect of improving adhesion and surface quality of products. Used in electronic circuit manufacturing technology | Japan | Lit | 320.00 | 3,252.23 | 10.16 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | CIRCUPOSIT (TM) 6540A REDUCER 90-99% water and Dimethylamine borane 1- 10% have the effect of smoothing the surface of the board's copper layer. Used in electronic board manufacturing technology. | China | Lit | 300.00 | 4,136.40 | 13.79 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | CIRCUPOSIT P-6550A ELESS CU / 20L without water 80-90% and Copper sulfate 10-20% , Sulfuric acid <1%. Used to improve adhesion and surface quality of products. Used in electronic circuit manufacturing technology | Taiwan | Lit | 3,000.00 | 10,450.98 | 3.48 | View Importer | View Supplier |
