| 26/Mar/2020 | 70200090 | PGLSP0160MIZZ # & Protective chip of electronic chip of camera module IR2142A-S | Japan | piece/pcs | 1,251,464.00 | 979,395.73 | 0.78 | View Importer | View Supplier |
| 26/Mar/2020 | 70200090 | PGLSP0162MIZZ # & Protective chip of electronic chip of camera module IR2143A-S | Japan | piece/pcs | 972,507.00 | 492,088.54 | 0.51 | View Importer | View Supplier |
| 26/Mar/2020 | 70200090 | PGLSP0129MIZZ # & Protective chip of electronic chip of camera module IR2129A-S | Japan | piece/pcs | 31,259.00 | 14,166.58 | 0.45 | View Importer | View Supplier |
| 26/Mar/2020 | 70200090 | PGLSP0130MIZZ # & Protective chip of electronic chip of camera module IR2130A-S | Japan | piece/pcs | 24,990.00 | 13,089.76 | 0.52 | View Importer | View Supplier |
| 23/Mar/2020 | 70200090 | PGLSP0162MIZZ # & Protective chip of electronic chip of camera module IR2143A-S | Japan | piece/pcs | 702,765.00 | 355,599.09 | 0.51 | View Importer | View Supplier |
| 23/Mar/2020 | 70200090 | PGLSP0160MIZZ # & Protective chip of electronic chip of camera module IR2142A-S | Japan | piece/pcs | 641,714.00 | 502,205.38 | 0.78 | View Importer | View Supplier |
| 20/Mar/2020 | 70171090 | AMT43 # & Quartz 18-0619200B / CT2016DB19200C0FLHA / XO / 19.2MHZ / 7pF / 2.0X1.6 are materials for manufacturing electronic circuit boards. New 100% | Japan | piece/pcs | 36,000.00 | 5,328.00 | 0.15 | View Importer | View Supplier |
| 19/Mar/2020 | 70200090 | PGLSP0160MIZZ # & Protective chip of electronic chip of camera module IR2142A-S | Japan | piece/pcs | 999,191.00 | 781,966.88 | 0.78 | View Importer | View Supplier |
| 19/Mar/2020 | 70200090 | PGLSP0162MIZZ # & Protective chip of electronic chip of camera module IR2143A-S | Japan | piece/pcs | 484,598.00 | 245,206.59 | 0.51 | View Importer | View Supplier |
| 18/Mar/2020 | 70200090 | PGLSP0118MIZZ # & Protective chip of electronic chip of camera module IR2118A-S | Japan | piece/pcs | 380,783.00 | 170,933.49 | 0.45 | View Importer | View Supplier |
| 18/Mar/2020 | 70200090 | Aligning piece for electronic device mounted XPF-L, made of glass, size 3.2x2.0x0.5mm, code AGGAJ8010. New 100% | Japan | piece/pcs | 2.00 | 116.48 | 58.24 | View Importer | View Supplier |
| 17/Mar/2020 | 70010000 | NSG-N # & Artificial rough quartz, used to produce electronic components and semiconductors NSG-N N-CORE-515X205L-NET | Japan | kg | 1,275.28 | 101,639.82 | 79.70 | View Importer | View Supplier |
| 17/Mar/2020 | 70010000 | NSG-N # & Artificial rough quartz, used to produce electronic components and semiconductors NSG-N N-SQ 775x230L (SQUARE) | Japan | kg | 3,242.35 | 189,418.09 | 58.42 | View Importer | View Supplier |
| 17/Mar/2020 | 70010000 | Q-OP1 # & Artificial hollow cylindrical quartz, used to manufacture electronic components and semiconductors OP1 OP-1-CYL-430X280X260L OP1 430 +/- 2mm OD x 280 +/- 2mm ID x 260 / + 2mm LENGTH CYLINDER | Japan | kg | 151.53 | 25,760.10 | 170.00 | View Importer | View Supplier |
| 17/Mar/2020 | 70010000 | Q-OP1 # & Artificial hollow cylindrical quartz, used to manufacture electronic components and semiconductors OP1 OP-1-CYL-430X280X130L OP1 430 +/- 2mm OD x 280 +/- 2mm ID x 130 / + 2mm LENGTH | Japan | kg | 124.85 | 10,612.25 | 85.00 | View Importer | View Supplier |
