31/Mar/2020 | 38101000 | Solder paste LFM-48W NH (IMT) -A 11.5% for soldering electronic circuit boards, main TP: Sn CAS 7440-31-5 (85.40%), Ag CAS 7440-22-4 (2.66%), Older CAS 7440-50-8 (0.44%). new 100%. | Japan | kg | 10.00 | 753.11 | 75.31 | View Importer | View Supplier |
30/Mar/2020 | 74199999 | 10020114 # & Copper ball, diameter 55mm, used for plating copper on electronic boards. | Japan | kg | 20,400.00 | 124,755.92 | 6.12 | View Importer | View Supplier |
27/Mar/2020 | 39073090 | Epoxide granulated plastic (EME) EME-XM8256, size: 16mm 6.0g, used to cover and protect the chip in the manufacture of electronic components. New 100%. | Japan | kg | 1.00 | 18.10 | 18.10 | View Importer | View Supplier |
26/Mar/2020 | 39079990 | 201AC P-B1 # & PBT (Polybutylene terephalate) Duranex 201AC P-B1 black plastic granules for molding electronic plastic components (100% New) | Japan | kg | 1,000.00 | 4,100.00 | 4.10 | View Importer | View Supplier |
26/Mar/2020 | 39079990 | PBT-201AC P-GR3 # & Plastic PBT (Polybutylene terephalate) Duranex 201AC P-GR3 gray plastic granules for molding electronic plastic parts (100% New) | Japan | kg | 1,000.00 | 4,100.00 | 4.10 | View Importer | View Supplier |
26/Mar/2020 | 39081090 | 1300G (B) # & PA / PA Leona (poly amide) black plastic granules for molding electronic components made of plastic (100% New) | Japan | kg | 3,375.00 | 20,250.00 | 6.00 | View Importer | View Supplier |
26/Mar/2020 | 39119000 | PPS / AR04 (B) # & PPS TORELINA (polyphenylene sulfide) is a new black plastic granule used for molding electronic components made of plastic (100% New) | Japan | kg | 350.00 | 3,465.00 | 9.90 | View Importer | View Supplier |
25/Mar/2020 | 35069900 | YB-005 # & Surface coating of components (Silicon) 1Kg / bag, used to coat the surface of electronic components for electronic control of car steering wheel angle. 100% new product, Part: YB-005 65154 HC-2000 1KG | Japan | kg | 2.00 | 95.16 | 47.58 | View Importer | View Supplier |
23/Mar/2020 | 38101000 | Solder paste, brand M705-GRN360-K2-VM, ingredients: Sn, Ag, Cu., Used to connect components with electronic boards. | Japan | kg | 25.00 | 2,384.75 | 95.39 | View Importer | View Supplier |
23/Mar/2020 | 38109000 | SU-KC # & Solder Paste Solder Paste SN97C P506 D4 for soldering electronic components. New 100% | Japan | kg | 10.00 | 750.00 | 75.00 | View Importer | View Supplier |
23/Mar/2020 | 39232990 | PE BAG PACKING ELECTRONIC PRODUCT 30 SET | Japan | kg | 30.00 | 115.50 | 3.85 | View Importer | View Supplier |
21/Mar/2020 | 35069900 | 1061976000 # & Electronic component adhesives M25-016 (BM2). Trade name: M25-016 (BM2) Binder. Ingredients: Vinyl butyral polymers> = 97%, water = <3%. | Japan | kg | 20.00 | 318.12 | 15.91 | View Importer | View Supplier |
21/Mar/2020 | 35069900 | 1061977000 # & Electronic components binder M25-017 (BMSZ). Trade name: M25-017 (BMSZ) Binder. Ingredients: Vinyl butyral polymers> = 97%, water = <3%. | Japan | kg | 20.00 | 330.12 | 16.51 | View Importer | View Supplier |
21/Mar/2020 | 35069900 | 1061976000 # & Electronic component adhesives M25-016 (BM2). Trade name: M25-016 (BM2) Binder. Ingredients: Vinyl butyral polymers> = 97%, water = <3%. | Japan | kg | 360.00 | 5,693.76 | 15.82 | View Importer | View Supplier |
21/Mar/2020 | 35069900 | 1061977000 # & Electronic components binder M25-017 (BMSZ). Trade name: M25-017 (BMSZ) Binder. Ingredients: Vinyl butyral polymers> = 97%, water = <3%. | Japan | kg | 170.00 | 2,819.28 | 16.58 | View Importer | View Supplier |