| 24/Mar/2020 | 38249999 | Additive for copper plating technology SD-550B (1L / Can) (Sodium hydroxide 25%, Ethylenediaminetetraacetic acidtetrasodium salt 3%, Additive 4%, Water 68%) New 100% .Number: 9092 / TB-TCHQ | Korea (Republic) | liter | 1.00 | 1.00 | 1.00 | View Importer | View Supplier |
| 24/Mar/2020 | 38249999 | Additive for copper plating technology SD-450B (1L / Can) (Sodium hydroxide 16%, Ethylenediaminetetraacetic acidtetrasodium salt 3%, Additive 3%, Water 78%) New 100% .Number: 9092 / TB-TCHQ | Korea (Republic) | liter | 1.00 | 1.00 | 1.00 | View Importer | View Supplier |
| 23/Mar/2020 | 38249999 | Additive in the process of plating circuit XP 263TMR-S1 (Sodium chloride 2 ~ 6%, Ethylenediaminetetraacetic acid disodium 11 ~ 16%, Butyl alcohol 3 ~ 8%, Water (Balance)), packed in 1 carton, 200kgs / carton 100% new | Korea (Republic) | kg | 200.00 | 7,156.00 | 35.78 | View Importer | View Supplier |
