| 27/Mar/2020 | 35069100 | RAA34549103 # & Adhesive from epoxy resin, used for manufacturing the circuit of mobile phones (Bisphenol F 75 - 85%, Amine Adduct 10 - 20%, Imidazole 1 - 5%, Pigment 0.1 - 1.0%, Secret 3 - 10%) ( RAA34549103). 100% new | Korea (Republic) | ml | 250.00 | 47.47 | 0.19 | View Importer | View Supplier |
| 19/Mar/2020 | 35069100 | Cooler for pairing BOND FB-500B (333ML / 1PC) - 100% new | Japan | ml | 73,260.00 | 1,762.48 | 0.02 | View Importer | View Supplier |
| 17/Mar/2020 | 35069100 | 5774 A / C # & Glue for binding and bonding metallic or non-metallic parts - URALANE 5774 A US / URALANE 5774 C PR US (50ML / 1PCE) | United Kingdom | ml | 660.00 | 460.56 | 0.70 | View Importer | View Supplier |
| 12/Mar/2020 | 35069100 | RAA34549103 # & Adhesive from epoxy resin, used for manufacturing the circuit of mobile phones (Bisphenol F 75 - 85%, Amine Adduct 10 - 20%, Imidazole 1 - 5%, Pigment 0.1 - 1.0%, Secret 3 - 10%) ( RAA34549103). 100% new | Korea (Republic) | ml | 750.00 | 142.42 | 0.19 | View Importer | View Supplier |
| 04/Mar/2020 | 35069100 | RAA34620201 # & Adhesive from epoxy resin, used for manufacturing mobile phone circuits (RAA34620201), 100% new | Korea (Republic) | ml | 30.00 | 36.41 | 1.21 | View Importer | View Supplier |
| 04/Mar/2020 | 35069100 | RAA34620201 # & Adhesive from epoxy resin, used for manufacturing blisters of mobile phones (RAA34620201). 100% new | Korea (Republic) | ml | 1,560.00 | 1,893.20 | 1.21 | View Importer | View Supplier |
| 04/Mar/2020 | 35069100 | RAA34620201 # & Adhesive from epoxy resin, used for manufacturing blisters of mobile phones (RAA34620201). 100% new | Korea (Republic) | ml | 3,030.00 | 3,677.18 | 1.21 | View Importer | View Supplier |
