| 31/Mar/2020 | 38249999 | Chemical preparations used as raw materials for the production of plating additives, in liquid form, with the composition of Propylene Glycol, symbol of goods COMP.31036FF, 200L / Drum, 100% new | Japan | liter | 200.00 | 4,136.81 | 20.68 | View Importer | View Supplier |
| 31/Mar/2020 | 38249999 | Chemical preparations used as raw materials for the production of plating additives, in liquid form, including Propylene Glycol, symbol of goods COMP.31036FF, 0.7L / Ctn, 100% new, (Goods FOC) | Japan | liter | 0.70 | 14.48 | 20.68 | View Importer | View Supplier |
| 27/Mar/2020 | 38241000 | Prepared binders for FC-C molds, brand new 100% | Japan | liter | 90.00 | 134.99 | 1.50 | View Importer | View Supplier |
| 27/Mar/2020 | 38249999 | 07020329 # & Copper Gleam (TM) HS-200B-1 (J) solution for plating containing Copper Sulphate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% Used in electronics industry | Japan | liter | 100.00 | 1,325.00 | 13.25 | View Importer | View Supplier |
| 26/Mar/2020 | 38249999 | 07020322 # & Cuposit (TM) 253S Electroless Copper - a mixture of water 80-90%; Copper sulfate 10-20%; Hydrochloric acid 0.1-1% for plating industry | Japan | liter | 60.00 | 754.20 | 12.57 | View Importer | View Supplier |
| 26/Mar/2020 | 38249999 | 07020329 # & Copper Gleam (TM) HS-200B-1 (J) solution for plating containing Copper Sulphate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% Used in electronics industry | Japan | liter | 20.00 | 265.00 | 13.25 | View Importer | View Supplier |
| 25/Mar/2020 | 38249999 | Metal surface cleaning preparations for plating, TOP GREENAL DESTMUT 400, liquid 1l / bottle, 1.8% suphuric acid tp, CAS (7664-93-9). 100% new. FOC goods | Japan | liter | 3.00 | 27.16 | 9.05 | View Importer | View Supplier |
| 25/Mar/2020 | 38249999 | Solvent for thinning paint 7400 Thinner (TP: Toluene 19.9%, xylene 16.5%, Ethylbenzene 13.2%, Butyl Acetate 20%, 2-methoxy-1-methylethyl acetate 30%, methyl isobutyl ketone 20%). New 100% | Japan | liter | 48.00 | 325.89 | 6.79 | View Importer | View Supplier |
| 25/Mar/2020 | 38249999 | ICP Nicoron FPF-2SV solvent (20L / CAN) (C3H9NO3: 12%, NAH2PO2.H2O 40%) for nickel plating line, 100% new goods | Japan | liter | 1,280.00 | 10,231.49 | 7.99 | View Importer | View Supplier |
| 25/Mar/2020 | 38249999 | 07020329 # & Copper Gleam (TM) HS-200B-1 (J) solution for plating containing Copper Sulphate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% Used in electronics industry | Japan | liter | 100.00 | 1,325.00 | 13.25 | View Importer | View Supplier |
| 25/Mar/2020 | 38249999 | Additive for plating - TOP LUCINA 2000MU UN1760 (18Lit / Can) | Japan | liter | 450.00 | 5,931.00 | 13.18 | View Importer | View Supplier |
| 24/Mar/2020 | 38249999 | CM-00169 # & Cuposit 1120SR Copper Replenisher for plating industry (Pyridine compound <1%; Sulfuric Acid H2SO4 <1%, Water> 98% (Omnishield 1120SR) | Japan | liter | 20.00 | 300.00 | 15.00 | View Importer | View Supplier |
| 24/Mar/2020 | 38249999 | CM-00169 # & Cuposit 1120SR Copper Replenisher for plating industry (Pyridine compound <1%; Sulfuric Acid H2SO4 <1%, Water> 98% (Omnishield 1120SR) | Japan | liter | 40.00 | 600.00 | 15.00 | View Importer | View Supplier |
| 20/Mar/2020 | 38249999 | 07020117 # & JC-BRITE 211STB: Chemical preparations for plating industry are mainly sulphated salts and additives in acidic environment, T / P: Sulfuric Acid -H2SO4 0.7%, Organic sulfur compound 0.2% | Japan | liter | 1,920.00 | 27,840.00 | 14.50 | View Importer | View Supplier |
| 20/Mar/2020 | 38249999 | COSMO K-1 COPPER PLATINAL ADDITIVES, FOR CREATING RESPONSE TO HELP GOOD GRINDING COPPER PLATED IN SPINDLE PRODUCTS. ASSESSED AT TTPTPLMN NO 1450 | Japan | liter | 760.00 | 6,384.00 | 8.40 | View Importer | View Supplier |
