| 31/Jan/2019 | 38249999 | Microfill EVF Brightener Solution contains 90-99% water, Sulfuric Acid 1-5% , Copper sulfate <1% , Formaldehyde 0 , 1 - <1% used in electroplating technology (20L / T-1,515) kg) | Taiwan | Lit | 1,500.00 | 21,150.00 | 14.10 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | Microfill EVF Leveler Solution contains 90-99% Water, Oxyalkylene Polymer <1% , Sulfuric Acid 1-5% , Copper Sulfate <1% used in electroplating technology (20L / T-505kg) | Taiwan | Lit | 500.00 | 9,410.00 | 18.82 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | 3 # & CM-00148: Corrosive liquid used to remove excess coating , trimming of the product after copper plating Shadow Microetch HP N500 (H2SO4: 1-5%; NaOH: 1-5%; C2H6O2 <3 %; C7H8O3S: 5-10% , Water: 77-90%) | Taiwan | Lit | 209.00 | 1,881.00 | 9.00 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | Circuposit (TM) MLB neutralizer 216-5 contains 60-70% water; Sulfuric acid 10-20%; Hydroxylammonium sulfate 1-10%; Glycolic acid 1-10% (20L / T-854kg) | Taiwan | Lit | 700.00 | 6,370.00 | 9.10 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | Water mixture 80-90%; Copper sulfate 10-20%; Hydrochloric acid 0 , 1-1% used in plating industry - cuposit TM 253A-2 electroless copper (20L / T) | Taiwan | Lit | 760.00 | 2,584.00 | 3.40 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | 50-60% water mixture; Tetrasodium salt of ethylenediamine-tetraacetic acid 30-40%; Propoxylated amine <1% for plating-cuposit TM 253E electroless copper (20L / T) | Taiwan | Lit | 1,200.00 | 6,120.00 | 5.10 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | Al-chelate preparations contain 60-70% swater; Sodium hydroxide 10-20%; Aliphatic carboxylic acid salt 10-20%; Monoethanolamine 1-5% for plating industry (20L / T) | Taiwan | Lit | 1,800.00 | 10,908.00 | 6.06 | View Importer | View Supplier |
| 30/Jan/2019 | 38249999 | J03367 # & Cleansing metal substrate - BLACKHOLE CLEANER | Taiwan | Lit | 20.00 | 330.19 | 16.51 | View Importer | View Supplier |
| 30/Jan/2019 | 38249999 | J03368 # & Metal surface cleaning preparations for plating - BLACKHOLE AF CONDITIONER | Taiwan | Lit | 20.00 | 727.49 | 36.37 | View Importer | View Supplier |
| 29/Jan/2019 | 38249999 | Chemical preparations used in plating , consisting of sodium saccarin , sodium tartate , potassium tartate CSZ-15 A | Taiwan | Lit | 100.00 | 15,075.00 | 150.75 | View Importer | View Supplier |
| 29/Jan/2019 | 38249999 | Chemical preparations used in plating , composed of sodium saccarin , sodium tartate , potassium tartate CSZ-15 C | Taiwan | Lit | 180.00 | 26,197.20 | 145.54 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | Copper Gleam (TM) HS-200 Part A solution contains water90-99%; Sulfuric acid 0 , 1-1%; 1-Propanesulfonic acid , 3 , 3'dithiobis- , disodium sal 1-5%; Copper sulfate 0 , 1-1% used in electronics industry (20L / T) | Taiwan | Lit | 220.00 | 4,433.00 | 20.15 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | Circuposit (TM) MLB neutralizer 216-5 contains 60-70% water; Sulfuric acid 10-20%; Hydroxylammonium sulfate 1-10%; Glycolic acid 1-10% (20L / T-366kg) | Taiwan | Lit | 300.00 | 2,730.00 | 9.10 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | Microfill EVF Leveler Solution contains 90-99% water, Oxyalkylene Polymer <1% , Sulfuric Acid 1-5% , Copper Sulfate <1% used in electroplating technology (20L / T-303kg) | Taiwan | Lit | 300.00 | 5,646.00 | 18.82 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | Water mixture 80-90%; Copper sulfate 10-20%; Hydrochloric acid 0 , 1-1% used in plating industry - cuposit TM 253A-2 electroless copper (20L / T) | Taiwan | Lit | 600.00 | 2,040.00 | 3.40 | View Importer | View Supplier |
