30/Mar/2020 | 38249999 | Chemical preparations for plating industry BLACKHOLE CLEANER, Ingredients include Aminoethanolamine (cas: 111-41-1) and additives. 100% new products | Taiwan | liter | 600.00 | 33,642.00 | 56.07 | View Importer | View Supplier |
30/Mar/2020 | 38249999 | Chemical preparations for plating industry BLACKHOLE AF CONDITIONER, whose main ingredients are Aminoethanolamine (cas: 111-41-1) and additives. 100% new goods. (According to results ptpl 1622 / TB-TCHQ dated March 16, 2020 | Taiwan | liter | 300.00 | 16,821.00 | 56.07 | View Importer | View Supplier |
30/Mar/2020 | 38249999 | MACuPrep Etch G-5S metal surface scrub. New 100% | Taiwan | liter | 200.00 | 744.00 | 3.72 | View Importer | View Supplier |
30/Mar/2020 | 38249999 | Preparations used in plating to polish the surface of electroplated copper CUPROSTAR ST-2000 CORRECTOR (ingredients: sulfuric acid 1-10%, Organic salt 0.1-1%, copper su (according to ptpl No. 119 / TB-KĐHQ day) 10/05/2019) | Taiwan | liter | 200.00 | 5,200.00 | 26.00 | View Importer | View Supplier |
27/Mar/2020 | 38249999 | CM-00022 # & Dust cleaning agent on product surface of BH-610 carbon plating line (C4H12N2O: 18-24%, Cationic Surfactant: 17%, Water: 59-65%) | Taiwan | liter | 200.00 | 3,503.32 | 17.52 | View Importer | View Supplier |
27/Mar/2020 | 38249999 | 07020122 # & Microfill EVF Brightener Solution containing 90-99% Water, Sulfuric Acid 1-5%, Copper sulfate <1%, Formaldehyde 0.1 - <1% used in electroplating technology | Taiwan | liter | 600.00 | 8,460.00 | 14.10 | View Importer | View Supplier |
27/Mar/2020 | 38249999 | 07020123 # & Microfill EVF Leveler Solution contains 90-99% Water, Oxyalkylene Polymer <1%, Sulfuric Acid 1-5%, Copper Sulfate <1% used in electroplating technology | Taiwan | liter | 300.00 | 5,646.00 | 18.82 | View Importer | View Supplier |
27/Mar/2020 | 38249999 | 07020309 # & Water mixture 80-90%; Copper sulfate 10-20%; Hydrochloric acid 0.1-1% for plating-cuposit TM 253A-2 electroless copper industry | Taiwan | liter | 2,000.00 | 6,800.00 | 3.40 | View Importer | View Supplier |
27/Mar/2020 | 38249999 | 07020308 # & Mixed water 50-60%; Tetrasodium salt of ethylenediamine-tetraacetic acid 30-40%; Propoxylated amine <1% for plating-cuposit TM 253E electroless copper industry | Taiwan | liter | 1,000.00 | 5,100.00 | 5.10 | View Importer | View Supplier |
27/Mar/2020 | 38249999 | 07020802 # & circuposit (TM) MLB neutralizer 216-5 contains 60-70% water; Sulfuric acid 10-20%; Hydroxylammonium sulfate 1-10%; Glycolic acid 1-10% | Taiwan | liter | 400.00 | 3,640.00 | 9.10 | View Importer | View Supplier |
27/Mar/2020 | 38249999 | 07020130 # & MICROFILL THF 100 B-1 (TM) solution containing 90-99% Water, Sulfuric Acid 1-5%, Copper sulfate <1%, Formaldehyde 0.1 - <1% used in electroplating technology | Taiwan | liter | 400.00 | 14,864.00 | 37.16 | View Importer | View Supplier |
27/Mar/2020 | 38249999 | 0 # & Chemical additives (increase the adhesion of the coating to s / p) used in plating, containing: 0.1-1% sulfuric acid, Sulfuric acid copper (2+) salt (1: 1), hydrate (1 : 5) 0.1-1%, (MACUSPEC VF-TH 200 WETTER) | Taiwan | liter | 800.00 | 32,064.00 | 40.08 | View Importer | View Supplier |
27/Mar/2020 | 38249999 | 0 # & Chemical additives (increasing the adhesion of the coating to s / p) used in plating: sulfuric acid 0.1-1%, sulfuric copper (2+) salt (1: 1), hydrate (1: 5) 0.1-1%, (MACUSPEC VF-TH 200 BR. REPL) | Taiwan | liter | 1,800.00 | 68,346.00 | 37.97 | View Importer | View Supplier |
27/Mar/2020 | 38249999 | 0 # & Chemical additives (increase the adhesion of the coating to s / p) used in plating: sulfuric acid 0.01-0.1%, Sulfuric acid copper (2+) salt (1: 1), hydrate (1: 5) 0.1-1%, (MacuSpec VF-TH200 Leveler REPL) | Taiwan | liter | 800.00 | 34,592.00 | 43.24 | View Importer | View Supplier |
27/Mar/2020 | 38249999 | 07020309 # & Water mixture 80-90%; Copper sulfate 10-20%; Hydrochloric acid 0.1-1% for plating-cuposit TM 253A-2 electroless copper industry | Taiwan | liter | 2,000.00 | 6,800.00 | 3.40 | View Importer | View Supplier |