| 31/Mar/2020 | 84864030 | Mold used to print tin solder paste on printed circuit boards (TA800JXE_VE), for solder paste printing machines, 100% new. | Korea (Republic) | piece/pcs | 1.00 | 508.04 | 508.04 | View Importer | View Supplier |
| 31/Mar/2020 | 84864030 | Mold used to print tin solder paste on printed circuit boards (TA200EXE_VE2), used for solder paste printing machines, 100% new. | Korea (Republic) | piece/pcs | 10.00 | 1,673.62 | 167.36 | View Importer | View Supplier |
| 27/Mar/2020 | 84864030 | The bottom mold is used to print solder paste onto the printed circuit board (ETA0U83EWE) for solder paste printing machine, 100% new. | Korea (Republic) | piece/pcs | 1.00 | 292.92 | 292.92 | View Importer | View Supplier |
| 27/Mar/2020 | 84864030 | The bottom mold is used to print solder paste onto the printed circuit board (ETA0U83EWE) for solder paste printing machine, 100% new. | Korea (Republic) | piece/pcs | 1.00 | 292.92 | 292.92 | View Importer | View Supplier |
| 27/Mar/2020 | 84864030 | The bottom mold is used to print solder paste onto the printed circuit board (ETA3U30EBE) for solder paste printing machine, 100% new. | Korea (Republic) | piece/pcs | 1.00 | 292.92 | 292.92 | View Importer | View Supplier |
| 25/Mar/2020 | 84864030 | Bottom mold for molding machines using compression molds, used in the manufacture of semiconductor panels, model: M200207-0409-1 | Korea (Republic) | piece/pcs | 1.00 | 2,834.37 | 2,834.37 | View Importer | View Supplier |
| 25/Mar/2020 | 84864030 | Bottom die making mold for die casting machine using compression molds, used in semiconductor sheet manufacturing, model: M200207-0409-2 | Korea (Republic) | piece/pcs | 1.00 | 2,834.37 | 2,834.37 | View Importer | View Supplier |
| 25/Mar/2020 | 84864030 | Bottom die making mold for die casting machine using compression molds, used in semiconductor sheet manufacturing, model: M200207-0409-3 | Korea (Republic) | piece/pcs | 1.00 | 2,834.37 | 2,834.37 | View Importer | View Supplier |
| 25/Mar/2020 | 84864030 | Bottom die making mold for die casting machine using compression molds, used in semiconductor sheet manufacturing, model: M200207-0409-4 | Korea (Republic) | piece/pcs | 1.00 | 2,834.37 | 2,834.37 | View Importer | View Supplier |
| 25/Mar/2020 | 84864030 | Bottom mold for molding machines using compression molds, used in the manufacture of semiconductor panels, model: M200207-0409-5 | Korea (Republic) | piece/pcs | 1.00 | 2,834.37 | 2,834.37 | View Importer | View Supplier |
| 24/Mar/2020 | 84864030 | Tin sealer used for printing solder paste onto a printed circuit board (EP-TA845) of the laptop power adapter for solder paste printers, 100% new | Korea (Republic) | piece/pcs | 1.00 | 421.00 | 421.00 | View Importer | View Supplier |
| 05/Mar/2020 | 84864030 | Semiconductor mold assembly frame and 285 removable synchronous mounting pads (Brand: GNT, model: 30085 SL ST 16M (90B-06L), year of manufacture: 2014) -MOLD_30085 SL ST 16M 90B-06L STA AA AND 285EA SPARE -Secondhand | Korea (Republic) | set | 1.00 | 4,614.20 | 4,614.20 | View Importer | View Supplier |
| 05/Mar/2020 | 84864030 | Mold making semiconductor frame (Brand: WOOSUNG, model: 30085 SL ST 16M 0.4T, year of manufacture: 2015) -MOLD_30085 SL ST 16M 90B-06L IMD MA-used goods | Korea (Republic) | piece/pcs | 1.00 | 10,364.41 | 10,364.41 | View Importer | View Supplier |
| 05/Mar/2020 | 84864030 | Mold of semi-conductor frame (Brand: GNT, model: 30085-16MI (90B-06LI2UP T / F), year of manufacture: 2015) -MOLD_30085 SL ST 16M 90B-06L STC CA-used goods | Korea (Republic) | piece/pcs | 1.00 | 1,471.40 | 1,471.40 | View Importer | View Supplier |
| 04/Mar/2020 | 84864030 | The upper mold is used to print solder paste onto the printed circuit board (EP-TA800XXX_VE) for solder paste printing machine, 100% new. | Korea (Republic) | piece/pcs | 1.00 | 61.18 | 61.18 | View Importer | View Supplier |
