| Date | HS Code | Product Description | Origin Country | Unit | Quantity | Total Value [USD] | Unit Price [USD] | Importer Name | Supplier Name |
|---|---|---|---|---|---|---|---|---|---|
| 13/Mar/2020 | 38249999 | OCHW00002 # & Chemicals used to remove Cu layer on wafer (MKS-4000N PHS) DI water 88.8%; Hydrogen peroxide 1.2% for strip strip (cleaning) parts before WLP (NON-DG) | Korea (Republic) | liter | 300.00 | 6,237.00 | 20.79 | View Importer | View Supplier |
| 13/Mar/2020 | 38249999 | OCHW00003 # & Tifer slurry (WTE-100A), hydrogen peroxide 30%; WATER 68% for strip (cleaning) parts before WLP (UN2014 / CLASS 5.1 / PG II) | Korea (Republic) | liter | 105.00 | 3,249.75 | 30.95 | View Importer | View Supplier |
| 11/Mar/2020 | 3824999990 | LSM-000083 # & Chemical for plating tanks, additive HYPERZINC 300A (containing NaHSO3 Sodium hydrogen sulfide, H2O water), 20kg / can | Japan | kg | 160.00 | 3,511.77 | 21.95 | View Importer | View Supplier |
| 02/Mar/2020 | 38249999 | OCHW00002 # & Chemicals used to remove Cu layer on wafer (MKS-4000N PHS) DI water 88.8%; Hydrogen peroxide 1.2% for strip strip (cleaning) parts before WLP (NON-DG) | Korea (Republic) | liter | 300.00 | 4,944.00 | 16.48 | View Importer | View Supplier |
