| 27/Mar/2020 | 34059010 | 07010111 # & Clean Etch CPB-79-1 contains sulfuric acid (H2SO4) <5%, hydrogen peroxide (H2O2) 35% and water - used to support the surface grinding and polishing process. | Japan | kg | 20,000.00 | 36,800.00 | 1.84 | View Importer | View Supplier |
| 16/Mar/2020 | 34059010 | 07010111 # & Clean Etch CPB-79-1 contains sulfuric acid (H2SO4) <5%, hydrogen peroxide (H2O2) 35% and water - used to support the surface grinding and polishing process. | Japan | kg | 20,000.00 | 36,800.00 | 1.84 | View Importer | View Supplier |
| 11/Mar/2020 | 3824999990 | LSM-000083 # & Chemical for plating tanks, additive HYPERZINC 300A (containing NaHSO3 Sodium hydrogen sulfide, H2O water), 20kg / can | Japan | kg | 160.00 | 3,511.77 | 21.95 | View Importer | View Supplier |
| 05/Mar/2020 | 38101000 | Preparations to brighten the surface of copper coating based on Acid MELPOLISH COPPER 58 (20 KG / can) (TP: Phosphoric acid 60-70%, NITRIC ACID 1-10%, HYDROGEN CHLORIDE 0.2%, WATER). 100% new goods .Number: 576 / TB-KĐHQ | Japan | kg | 50.00 | 600.00 | 12.00 | View Importer | View Supplier |
| 03/Mar/2020 | 34059010 | 07010111 # & Clean Etch CPB-79-1 contains sulfuric acid (H2SO4) <5%, hydrogen peroxide (H2O2) 35% and water - used to support the surface grinding and polishing process. | Japan | kg | 20,000.00 | 36,800.00 | 1.84 | View Importer | View Supplier |
| 24/Jan/2019 | 28331900 | Heavy metal repair agent , ingredient is sodium hydrogen sulfide and water-soluble derivative dithiocarbamine - EPOFLOC L-1 (20 Kg / can) | Japan | Kg | 200.00 | 3,422.00 | 17.11 | View Importer | View Supplier |
| 18/Jan/2019 | 34029019 | Chemicals for plating tanks , additive HYPERZINC 300A (containing NaHSO3 sodium hydrogen sulfide: 1-10% , H2O water: 90-95%) , 20kg / can. CAS 7631-90-5 | Japan | Kg | 120.00 | 2,632.69 | 21.94 | View Importer | View Supplier |
| 11/Jan/2019 | 34059010 | Clean Etch grinding chemicals CPB-79-1 contain sulfuric acid (H2SO4) <5% , hydrogen peroxide (H2O2) 35% and water - used to support the grinding process , polishing the surface of the board. | Japan | Kg | 20,000.00 | 37,300.00 | 1.87 | View Importer | View Supplier |
| 08/Jan/2019 | 34059010 | Clean Etch grinding chemicals CPB-79-1 contain sulfuric acid (H2SO4) <5% , hydrogen peroxide (H2O2) 35% and water - used to support the grinding process , polishing the surface of the board. | Japan | Kg | 20,000.00 | 37,300.00 | 1.87 | View Importer | View Supplier |
