| 26/Mar/2020 | 38249999 | 07020124 # & Microfill Solution (TM) EVF-C2 contains Sulfuric acid (H2SO4) 0.1-1%, Copper sulfate (CuSO4) 0.1-1%, Formaldehyde (CH2O) 0.1-1%, Polyalkyleneglycol used in plating industry | Japan | liter | 1,000.00 | 20,880.00 | 20.88 | View Importer | View Supplier |
| 26/Mar/2020 | 38249999 | 07020124 # & Microfill Solution (TM) EVF-C2 contains Sulfuric acid (H2SO4) 0.1-1%, Copper sulfate (CuSO4) 0.1-1%, Formaldehyde (CH2O) 0.1-1%, Polyalkyleneglycol used in plating industry | Japan | liter | 80.00 | 1,670.40 | 20.88 | View Importer | View Supplier |
| 25/Mar/2020 | 38249999 | 07020124 # & Microfill Solution (TM) EVF-C2 contains Sulfuric acid (H2SO4) 0.1-1%, Copper sulfate (CuSO4) 0.1-1%, Formaldehyde (CH2O) 0.1-1%, Polyalkyleneglycol used in plating industry | Japan | liter | 500.00 | 10,440.00 | 20.88 | View Importer | View Supplier |
| 23/Mar/2020 | 38249999 | 07020124 # & Microfill Solution (TM) EVF-C2 contains Sulfuric acid (H2SO4) 0.1-1%, Copper sulfate (CuSO4) 0.1-1%, Formaldehyde (CH2O) 0.1-1%, Polyalkyleneglycol used in plating industry | Japan | liter | 500.00 | 10,440.00 | 20.88 | View Importer | View Supplier |
| 20/Mar/2020 | 38249999 | Microfill solution (TM) EVF-C2 contains Sulfuric acid (H2SO4) 0.1-1%, Copper sulfate (CuSO4) 0.1-1%, Formaldehyde (CH2O) 0.1-1%, Polyalkyleneglycol for industrial use plating 11095904 (20 liters / carton) (1,015 Kg) | Japan | liter | 1,920.00 | 22,161.22 | 11.54 | View Importer | View Supplier |
| 12/Mar/2020 | 38249999 | MICROFILL EVF-C2 / 20L PDR falls under section 15 tk 102496191931 of February 22, 2019 | Japan | liter | 0.06 | 1.25 | 20.88 | View Importer | View Supplier |
| 11/Mar/2020 | 38249999 | 07020124 # & Microfill Solution (TM) EVF-C2 contains Sulfuric acid (H2SO4) 0.1-1%, Copper sulfate (CuSO4) 0.1-1%, Formaldehyde (CH2O) 0.1-1%, Polyalkyleneglycol used in plating industry | Japan | liter | 300.00 | 6,264.00 | 20.88 | View Importer | View Supplier |
| 05/Mar/2020 | 38249999 | 07020124 # & Microfill Solution (TM) EVF-C2 contains Sulfuric acid (H2SO4) 0.1-1%, Copper sulfate (CuSO4) 0.1-1%, Formaldehyde (CH2O) 0.1-1%, Polyalkyleneglycol used in plating industry | Japan | liter | 800.00 | 16,704.00 | 20.88 | View Importer | View Supplier |
| 03/Mar/2020 | 38249999 | 07020124 # & Microfill Solution (TM) EVF-C2 contains Sulfuric acid (H2SO4) 0.1-1%, Copper sulfate (CuSO4) 0.1-1%, Formaldehyde (CH2O) 0.1-1%, Polyalkyleneglycol used in plating industry | Japan | liter | 600.00 | 12,528.00 | 20.88 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | Microfill (TM) EVF-C2 solution contains Sulfuric acid (H2SO4) 0 , 1-1% , Copper sulfate (CuSO4) 0 , 1-1% , Formaldehyde (CH2O) 0 , 1-1% , Polyalkyleneglycol used in plating industry 11095904 (20L / T) | Japan | Lit | 500.00 | 10,440.00 | 20.88 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | Microfill (TM) EVF-C2 solution contains Sulfuric acid (H2SO4) 0 , 1-1% , Copper sulfate (CuSO4) 0 , 1-1% , Formaldehyde (CH2O) 0 , 1-1% , Polyalkyleneglycol used in plating industry 11095904 (20L / T) | Japan | Lit | 500.00 | 10,440.00 | 20.88 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | MICROFILL THF 100 B-1 (TM) solution contains Water 90-99% , Sulfuric Acid 1-5% , Copper sulfate <1% , Formaldehyde 0 , 1 - <1% used in electroplating technology ( 20L / T-404kg) | Japan | Lit | 400.00 | 14,864.00 | 37.16 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | MICROFILL THF 100 B-1 (TM) solution contains Water 90-99% , Sulfuric Acid 1-5% , Copper sulfate <1% , Formaldehyde 0 , 1 - <1% used in electroplating technology ( 20L / T-303kg) | Japan | Lit | 300.00 | 11,148.00 | 37.16 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | Microfill (TM) EVF-C2 solution contains Sulfuric acid (H2SO4) 0 , 1-1% , Copper sulfate (CuSO4) 0 , 1-1% , Formaldehyde (CH2O) 0 , 1-1% , Polyalkyleneglycol used in plating industry 11095904 (20 liters / carton) (1,015 Kg) | Japan | Lit | 1,280.00 | 17,716.17 | 13.84 | View Importer | View Supplier |
| 15/Jan/2019 | 38249999 | MICROFILL THF 100 B-1 (TM) solution contains Water 90-99% , Sulfuric Acid 1-5% , Copper sulfate <1% , Formaldehyde 0 , 1 - <1% used in electroplating technology ( 20L / T-303kg) | Japan | Lit | 300.00 | 11,148.00 | 37.16 | View Importer | View Supplier |
