| 31/Jan/2019 | 38249999 | Microfill EVF Brightener Solution contains 90-99% water, Sulfuric Acid 1-5% , Copper sulfate <1% , Formaldehyde 0 , 1 - <1% used in electroplating technology (20L / T-1,515) kg) | Taiwan | Lit | 1,500.00 | 21,150.00 | 14.10 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | Microfill EVF Leveler Solution contains 90-99% Water, Oxyalkylene Polymer <1% , Sulfuric Acid 1-5% , Copper Sulfate <1% used in electroplating technology (20L / T-505kg) | Taiwan | Lit | 500.00 | 9,410.00 | 18.82 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | Microfill (TM) EVF-C2 solution contains Sulfuric acid (H2SO4) 0 , 1-1% , Copper sulfate (CuSO4) 0 , 1-1% , Formaldehyde (CH2O) 0 , 1-1% , Polyalkyleneglycol used in plating industry 11095904 (20L / T) | Japan | Lit | 500.00 | 10,440.00 | 20.88 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | Microfill EVF Leveler Solution contains 90-99% water, Oxyalkylene Polymer <1% , Sulfuric Acid 1-5% , Copper Sulfate <1% used in electroplating technology (20L / T-303kg) | Taiwan | Lit | 300.00 | 5,646.00 | 18.82 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | Microfill (TM) EVF-C2 solution contains Sulfuric acid (H2SO4) 0 , 1-1% , Copper sulfate (CuSO4) 0 , 1-1% , Formaldehyde (CH2O) 0 , 1-1% , Polyalkyleneglycol used in plating industry 11095904 (20L / T) | Japan | Lit | 500.00 | 10,440.00 | 20.88 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | MICROFILL THF 100 B-1 (TM) solution contains Water 90-99% , Sulfuric Acid 1-5% , Copper sulfate <1% , Formaldehyde 0 , 1 - <1% used in electroplating technology ( 20L / T-404kg) | Japan | Lit | 400.00 | 14,864.00 | 37.16 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | Microfill EVF Brightener Solution contains 90-99% water, Sulfuric Acid 1-5% , Copper sulfate <1% , Formaldehyde 0 , 1 - <1% used in electroplating technology (20L / T-303kg ) | Taiwan | Lit | 300.00 | 4,230.00 | 14.10 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | Microfill EVF Leveler Solution contains 90-99% Water, Oxyalkylene Polymer <1% , Sulfuric Acid 1-5% , Copper Sulfate <1% used in electroplating technology (20L / T-606kg) | Taiwan | Lit | 600.00 | 11,292.00 | 18.82 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | MICROFILL THF 100 B-1 (TM) solution contains Water 90-99% , Sulfuric Acid 1-5% , Copper sulfate <1% , Formaldehyde 0 , 1 - <1% used in electroplating technology ( 20L / T-303kg) | Japan | Lit | 300.00 | 11,148.00 | 37.16 | View Importer | View Supplier |
| 24/Jan/2019 | 38249999 | Microfill EVF Brightener Solution contains 90-99% Water, Sulfuric Acid 1-5% , Copper sulfate <1% , Formaldehyde 0 , 1 - <1% used in electroplating technology | Taiwan | Lit | 640.00 | 5,149.63 | 8.05 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | Microfill (TM) EVF-C2 solution contains Sulfuric acid (H2SO4) 0 , 1-1% , Copper sulfate (CuSO4) 0 , 1-1% , Formaldehyde (CH2O) 0 , 1-1% , Polyalkyleneglycol used in plating industry 11095904 (20 liters / carton) (1,015 Kg) | Japan | Lit | 1,280.00 | 17,716.17 | 13.84 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | MICROFILL THF 100 B-1 solution contains 90-99% water, Sulfuric Acid 1-5% , Copper sulfate <1% , Formaldehyde 0 , 1 - <1% used in electroplating technology | Taiwan | Lit | 1,280.00 | 30,514.57 | 23.84 | View Importer | View Supplier |
| 15/Jan/2019 | 38249999 | MICROFILL THF 100 B-1 (TM) solution contains Water 90-99% , Sulfuric Acid 1-5% , Copper sulfate <1% , Formaldehyde 0 , 1 - <1% used in electroplating technology ( 20L / T-303kg) | Japan | Lit | 300.00 | 11,148.00 | 37.16 | View Importer | View Supplier |
| 09/Jan/2019 | 38249999 | Microfill EVF Brightener Solution contains 90-99% water, Sulfuric Acid 1-5% , Copper sulfate <1% , Formaldehyde 0 , 1 - <1% used in electroplating technology (20L / T-202kg ) | Taiwan | Lit | 200.00 | 2,820.00 | 14.10 | View Importer | View Supplier |
| 09/Jan/2019 | 38249999 | Microfill EVF Leveler Solution contains 90-99% Water, Oxyalkylene Polymer <1% , Sulfuric Acid 1-5% , Copper Sulfate <1% used in electroplating technology (20L / T-505kg) | Taiwan | Lit | 500.00 | 9,410.00 | 18.82 | View Importer | View Supplier |
