| 27/Mar/2020 | 35069900 | MA07080076 # & 8800C CLEAR PASTE 20KG - Transparent glue used in the printing process, ingredients: CAS: 9009-54-5; 57-55-6; 25035-69-2; 7732-18-5, brand new 100% | China | g | 800,000.00 | 7,200.05 | 0.01 | View Importer | View Supplier |
| 27/Mar/2020 | 35069900 | MA07080077 # & 8800W WHITE PASTE 20KG - Transparent glue used in the printing process, ingredients: CAS: 9009-54-5; 57-55-6; 25035-69-2; 13463-67-7; 7732-18-5, brand new 100% | China | g | 240,000.00 | 2,160.02 | 0.01 | View Importer | View Supplier |
| 26/Mar/2020 | 35069900 | HIKATBP0002 # & Adhesive components for printed circuit board HI-POXY 4210F | Vietnam | g | 7,887.00 | 5,921.75 | 0.75 | View Importer | View Supplier |
| 26/Mar/2020 | 35069900 | KMSASF00001 # & Glue components for printed circuits | Vietnam | g | 10,000.00 | 2,509.75 | 0.25 | View Importer | View Supplier |
| 25/Mar/2020 | 35069900 | MA07080067 # & PU-46 glossy paste - Glue coating increases brightness and gloss used in shoe manufacturing and printing industry; Ingredients: CAS no: 9017-09-8; 57-55-6; 25035-69-2; 7732-18-5, brand new 100% | China | g | 300,000.00 | 1,859.92 | 0.01 | View Importer | View Supplier |
| 25/Mar/2020 | 35069900 | PELG # & Peelable W0820 MI-T004YF6 can be used to print on scratch-proof glass | Japan | g | 128,000.00 | 2,242.12 | 0.02 | View Importer | View Supplier |
| 24/Mar/2020 | 35069900 | E-5913L000 # & UV Epoxy HI-UV5913L: HI-UV5913L type glue made from Epoxy resin attaching plastic details on PCB printed circuit board | Korea (Republic) | g | 516.00 | 635.71 | 1.23 | View Importer | View Supplier |
| 24/Mar/2020 | 35069900 | UE32HI03 # & 9555B-6 type glue made from Epoxy resin used to attach the printed circuit protection parts | Korea (Republic) | g | 1,764.00 | 1,150.13 | 0.65 | View Importer | View Supplier |
| 23/Mar/2020 | 35069900 | HIKCHPH0002 # & Adhesive components for printed circuits | Korea (Republic) | g | 330.00 | 243.44 | 0.74 | View Importer | View Supplier |
| 23/Mar/2020 | 35069900 | HIKATBP0002 # & Adhesive components for printed circuit board HI-POXY 4210F | Korea (Republic) | g | 9,900.00 | 7,303.23 | 0.74 | View Importer | View Supplier |
| 20/Mar/2020 | 35069900 | HIKATBP0002 # & Adhesive components for printed circuit board HI-POXY 4210F | Vietnam | g | 9,900.00 | 7,478.76 | 0.76 | View Importer | View Supplier |
| 19/Mar/2020 | 35069900 | MA07080064 # & 8811W - Glue used in the printing process, CAS component: 9009-54-5 (32-41%), 57-55-6 (4-8%), 25035-69-2 (0.5-1.5% ), 13463-67-7 (10-15%), 7732-18-5. | China | g | 800,000.00 | 7,200.05 | 0.01 | View Importer | View Supplier |
| 19/Mar/2020 | 35069900 | MA07080063 # & 8811C - Glue used in the printing process, CAS component: 9009-54-5 (32-41%), 57-55-6 (4-8%), 25035-69-2 (0.5-1.5% ), 7732-18-5. | China | g | 3,000,000.00 | 27,000.19 | 0.01 | View Importer | View Supplier |
| 19/Mar/2020 | 35069900 | MA07080064 # & 8811W - Glue used in the printing process, CAS component: 9009-54-5 (32-41%), 57-55-6 (4-8%), 25035-69-2 (0.5-1.5% ), 13463-67-7 (10-15%), 7732-18-5. | China | g | 400,000.00 | 3,600.03 | 0.01 | View Importer | View Supplier |
| 16/Mar/2020 | 35069900 | HIKATBP0001 # & Adhesives for printed circuit boards (HI-POXY 4007) | Korea (Republic) | g | 330.00 | 243.44 | 0.74 | View Importer | View Supplier |
