| 27/Mar/2020 | 34059010 | 07010111 # & Clean Etch CPB-79-1 contains sulfuric acid (H2SO4) <5%, hydrogen peroxide (H2O2) 35% and water - used to support the surface grinding and polishing process. | Japan | kg | 20,000.00 | 36,800.00 | 1.84 | View Importer | View Supplier |
| 16/Mar/2020 | 34059010 | 07010111 # & Clean Etch CPB-79-1 contains sulfuric acid (H2SO4) <5%, hydrogen peroxide (H2O2) 35% and water - used to support the surface grinding and polishing process. | Japan | kg | 20,000.00 | 36,800.00 | 1.84 | View Importer | View Supplier |
| 03/Mar/2020 | 34059010 | 07010111 # & Clean Etch CPB-79-1 contains sulfuric acid (H2SO4) <5%, hydrogen peroxide (H2O2) 35% and water - used to support the surface grinding and polishing process. | Japan | kg | 20,000.00 | 36,800.00 | 1.84 | View Importer | View Supplier |
| 15/Jan/2019 | 34059090 | CL7400B # & Polishing solution , the main component is organic salts , soluble in water , used in quartz polishing process. | China | Kg | 20.00 | 354.80 | 17.74 | View Importer | View Supplier |
| 14/Jan/2019 | 34059090 | LH30 # & Quartz polishing powder , used in polishing process , the main ingredient is CeO2 , code CAS 1806-38-3. | China | Kg | 300.00 | 4,851.00 | 16.17 | View Importer | View Supplier |
| 11/Jan/2019 | 34059010 | Clean Etch grinding chemicals CPB-79-1 contain sulfuric acid (H2SO4) <5% , hydrogen peroxide (H2O2) 35% and water - used to support the grinding process , polishing the surface of the board. | Japan | Kg | 20,000.00 | 37,300.00 | 1.87 | View Importer | View Supplier |
| 08/Jan/2019 | 34059010 | Clean Etch grinding chemicals CPB-79-1 contain sulfuric acid (H2SO4) <5% , hydrogen peroxide (H2O2) 35% and water - used to support the grinding process , polishing the surface of the board. | Japan | Kg | 20,000.00 | 37,300.00 | 1.87 | View Importer | View Supplier |
