| 31/Mar/2020 | 38101000 | TRI Chemical, cleaning metal surfaces, used in metal plating process. Chemical ingredients: sulfuric acid 29% -35%, Proprietary additive mixture max 5% and water. New 100% | Japan | liter | 8,000.00 | 86,720.00 | 10.84 | View Importer | View Supplier |
| 25/Mar/2020 | 38109000 | Polishing layer, processing products used in plating TOP TOP SELENA DDX-1, tp: organic compounds, ethanol, isopropyl alcohol, water, 20 liters / can, liquid, 100% new (cas 64-17-5,67- 63-0,7732-18-5) | Japan | liter | 40.00 | 396.50 | 9.91 | View Importer | View Supplier |
| 25/Mar/2020 | 38249999 | Chemical processing used in plating, main projects: combining acetate salt, nickel sulphate, sodium, additives in TOP SEAL H-298 acid field, liquid 20Lit / Can, New 100% (cas6018-89-9,7732-18-5) , PTPL: 10023 / TB-TCHQ | Japan | liter | 15,000.00 | 44,130.92 | 2.94 | View Importer | View Supplier |
| 19/Mar/2020 | 38249999 | NB-ZZ-TV, chemical used in electroplating process, 18L / can | Japan | liter | 90.00 | 1,395.00 | 15.50 | View Importer | View Supplier |
| 18/Mar/2020 | 38140000 | VAPOUR FLUX BL-5 (CH3O) 3B + CH3OH (20L) solvent (used to support the welding process) (METHANOL: 36-42% + TRIMETHYLE BORIC ACID: 58-64%) | Japan | liter | 160.00 | 1,579.86 | 9.87 | View Importer | View Supplier |
| 13/Mar/2020 | 38119090 | CS-CHEMLEASE # & Chemlease AF-7 EZ Mold Release agent (0.36 Kg / can) (Not directly involved in SP manufacturing process) | Japan | liter | 32.40 | 1,473.99 | 45.49 | View Importer | View Supplier |
| 04/Mar/2020 | 38249999 | Chemical products used in plating process are composed of sodium hypophotphite salt and liquid additives, Enilex Ni-100 B, 20L / polybtl, 100% new. | Japan | liter | 240.00 | 1,067.83 | 4.45 | View Importer | View Supplier |
| 04/Mar/2020 | 38249999 | Chemical products used in plating process are composed of sodium hypophotphite salt and liquid additives, Enilex Ni-100 B, 1L / Polybtl, 100% new (FOC). | Japan | liter | 1.00 | 4.45 | 4.45 | View Importer | View Supplier |
