| 31/Jan/2019 | 38159000 | MM04-004891 # & Catalysts , surface treatment of circuit boards in plating process | Korea (Republic) | Lit | 400.00 | 788.00 | 1.97 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | MM04-004896 # & Chemical Additives Copper Plating , Used in plating process | Korea (Republic) | Lit | 800.00 | 2,632.00 | 3.29 | View Importer | View Supplier |
| 25/Jan/2019 | 38159000 | MM04-004891 # & Catalysts , surface treatment of circuit boards in plating process | Korea (Republic) | Lit | 400.00 | 788.00 | 1.97 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | Active solution for HCATA 10A nickel plating process contains HYDROCHLORIC ACID 9% , PALLADIUM (II) CHLORIDE 1 , 75% .Secret 0.55%. , New arrivals 100% # & KR | Korea (Republic) | Lit | 80.00 | 3,781.60 | 47.27 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | MM04-004896 # & Chemical Additives Copper Plating , Used in plating process | Korea (Republic) | Lit | 800.00 | 2,632.00 | 3.29 | View Importer | View Supplier |
| 21/Jan/2019 | 38249999 | Active solution for HCATA 10A nickel plating process contains HYDROCHLORIC ACID 9% , PALLADIUM (II) CHLORIDE 1 , 75% .Secret 0.55%. , New arrivals 100% # & KR | Korea (Republic) | Lit | 1,581,230.00 | 2,731.56 | 0.00 | View Importer | View Supplier |
| 17/Jan/2019 | 38249999 | MM04-004896 # & Chemical Additives Copper Plating , Used in plating process | Korea (Republic) | Lit | 800.00 | 2,632.00 | 3.29 | View Importer | View Supplier |
| 15/Jan/2019 | 38249999 | Chemical ORC-445R (sulfuric acid 1-3% , palladium <1% , additive: 1-2% , Water (balance) , used as an additive in plate plating process | Korea (Republic) | Lit | 1,440.00 | 81,244.80 | 56.42 | View Importer | View Supplier |
| 15/Jan/2019 | 38249999 | ORC-410B (containing Sodium hydroxide 17-21% , Monoethanolamine 16-20% , water balance) , used as an additive in the plating process. New 100% | Korea (Republic) | Lit | 400.00 | 724.00 | 1.81 | View Importer | View Supplier |
| 14/Jan/2019 | 38249999 | Additives in the process of plating board , ORC-340B (OXIDIZER) (-Sodium hydroxide 23 ~ 25% -Water (balance)) , 100% new | Korea (Republic) | Lit | 3,600.00 | 6,696.00 | 1.86 | View Importer | View Supplier |
| 14/Jan/2019 | 38249999 | Additives in the process of plating the circuit board ORC-410B (CONDITIONER) (Sodium hydroxide 17 ~ 21% , Monoethanolamine 16 ~ 20% , Water (balance)) , 100% new | Korea (Republic) | Lit | 2,880.00 | 18,835.20 | 6.54 | View Importer | View Supplier |
| 14/Jan/2019 | 38249999 | Additives in the process of plating circuit , ORC-315H (SWELLER) (-Butyl Cabitol 17 ~ 19% -Monoethanolamine 16 ~ 18% -Water (balance)) , 100% new | Korea (Republic) | Lit | 2,880.00 | 16,041.60 | 5.57 | View Importer | View Supplier |
| 14/Jan/2019 | 38249999 | Additives in the process of plating circuit boards 445R (CATALYST) (Sulfuric acid 1 ~ 3% , Palladium 0.5 ~ 1% , Water (balance)) , 100% new | Korea (Republic) | Lit | 2,880.00 | 199,819.64 | 69.38 | View Importer | View Supplier |
| 11/Jan/2019 | 38249999 | MM04-004896 # & Chemical Additives Copper Plating , Used in plating process | Korea (Republic) | Lit | 1,400.00 | 4,606.00 | 3.29 | View Importer | View Supplier |
| 10/Jan/2019 | 38109000 | set-023 # & Soldering flux from processed rosin ILF-710 | Korea (Republic) | Lit | 360.00 | 1,094.07 | 3.04 | View Importer | View Supplier |
