| 27/Mar/2020 | 38249999 | MM04-004896 # & Chemical Additives Copper Plating HVFEL-CUMH1 (CONTAINS Sodium hydroxide 12 +/- 3%, Nickel Sulfate Hexahydrate <1%), USED IN PLACEMENT PROCESS | Korea (Republic) | liter | 800.00 | 2,496.00 | 3.12 | View Importer | View Supplier |
| 23/Mar/2020 | 38249999 | Chemical ORC-445R (sulfuric acid 1-3%, palladium <1%, additive: 1-2%, Water (balance), used as an additive in the plating process, packing 72 barrels, 20L / carton, New 100% | Korea (Republic) | liter | 1,440.00 | 145,886.40 | 101.31 | View Importer | View Supplier |
| 23/Mar/2020 | 38249999 | Additive of plating solution in PCB plating process, ORC-410H code contains Monoethanolamine CAS: 141-43-5, 27-31% / 2-propanol 1-5% CAS: 67-63-0, packed in 36 boxes , 20L / carton, 100% new | Korea (Republic) | liter | 720.00 | 2,808.00 | 3.90 | View Importer | View Supplier |
| 13/Mar/2020 | 38249999 | Electroplating agent in PCB manufacturing process ORC-410F (contains Monoethanolamine 18 ~ 23% CAS number: 141-43-5, Water (Balance)), packed in 36 boxes, 20L / carton, 100% new goods | Korea (Republic) | liter | 720.00 | 1,072.80 | 1.49 | View Importer | View Supplier |
| 13/Mar/2020 | 38249999 | Chemical ORC-445R (sulfuric acid 1-3%, palladium <1%, additive: 1-2%, Water (balance), used as an additive in the plating process, packing 72 barrels, 20L / carton, New 100% | Korea (Republic) | liter | 1,440.00 | 145,886.40 | 101.31 | View Importer | View Supplier |
| 13/Mar/2020 | 38249999 | Additives in the process of plating boards ORC-455 (Dimethylamine borane 4 ~ 7%, CAS: 74-94-2, Water Balance), packing 72 boxes, 20L / carton, 100% new goods | Korea (Republic) | liter | 1,440.00 | 8,884.80 | 6.17 | View Importer | View Supplier |
| 13/Mar/2020 | 38249999 | Additives in the process of plating the board ORC-340B, sodium hydroxide 23-25% CAS: 1310-73-2, packing 72 barrels, 20L / carton, 100% new goods | Korea (Republic) | liter | 1,440.00 | 1,396.80 | 0.97 | View Importer | View Supplier |
| 06/Mar/2020 | 38249999 | Chemical ORC-315H (Butyl Cabitol 17 ~ 19% CAS 112-34-5, N-Methylpyrrol 16 ~ 18% CAS 872-50-4, Water Balance) used as an additive in plate coating process, packaging 216 carton, 20l / carton. 100% new goods | Korea (Republic) | liter | 4,320.00 | 12,139.20 | 2.81 | View Importer | View Supplier |
| 02/Mar/2020 | 38249999 | Additive for non-electrolytic tin plating process K-TIN M, t / p: Citric acid 27 ~ 33%, 1,3-Butanediol17 ~ 21%, Thiourea10 ~ 13%, methanesulforic acid 8 ~ 12%, Sodium hypophosphite 5 ~ 9% and water 19 ~ 23%, new 100% (20l = can) | Korea (Republic) | liter | 2,560.00 | 9,139.20 | 3.57 | View Importer | View Supplier |
| 02/Mar/2020 | 38249999 | Additive for non-electrolytic tin plating process K-TIN A, ingredients: Tin (II) methanesulfonate 49 ~ 53%, methanesulfonic 7 ~ 10%, and water 39 ~ 42%. 100% new product (20l = can) | Korea (Republic) | liter | 280.00 | 4,751.60 | 16.97 | View Importer | View Supplier |
