| 13/Mar/2020 | 38249999 | KEN-531A non-electrolytic nickel plating solution, for printed circuit board industry, t / p: 35% nickel sulfate, and 65% water. 100% new product (20L / can) | Korea (Republic) | liter | 520.00 | 2,678.00 | 5.15 | View Importer | View Supplier |
| 13/Mar/2020 | 38249999 | KEN-531B non-electrolytic nickel plating solution, used for printed circuit board industry, t / p: 60% Sodium hypophosphite, and 40% water. 100% new product (20L / can) | Korea (Republic) | liter | 520.00 | 2,844.40 | 5.47 | View Importer | View Supplier |
| 06/Mar/2020 | 38249999 | NIKENTM NDL-5B plating solution, chemical preparation for plating industry, ingredients: 50% Sodium phosphinate, Latic acid 5%, Ammonium hydroxide 2%, and 43% water. 100% new product (20L = can) | Korea (Republic) | liter | 1,920.00 | 5,971.20 | 3.11 | View Importer | View Supplier |
| 06/Mar/2020 | 38249999 | NIKENTM NDL-5C plating solution, chemical preparation used in plating industry: Sodium hydroxide 15% and water 85%. 100% new product (20L = can) | Korea (Republic) | liter | 1,280.00 | 2,099.20 | 1.64 | View Importer | View Supplier |
| 02/Mar/2020 | 38249999 | NDL-5D Nickel plating solution, chemical preparation for plating industry, ingredients: 1% Sulfuric acid and 99% water. 100% new product (20l = can) | Korea (Republic) | liter | 1,920.00 | 3,072.00 | 1.60 | View Importer | View Supplier |
