| 30/Jan/2019 | 38249999 | CuSO4 cleaning solution adheres to copper after product Copper Gleam HVS-202B (J) (water 85-95%; Polyalkylene glycol 5-15%; Polymer 1-5%; Sulfuric acid 0 , 1-1 %; Copper sulfate 0 , 1-1%) | Japan | Lit | 640.00 | 14,377.74 | 22.47 | View Importer | View Supplier |
| 30/Jan/2019 | 38249999 | CIRCUPOSIT P-6550M (VN) / 20L without water 75 - 85% and Organic salt 15 - 25%. Has the effect of improving adhesion and surface quality of products. Used in electronic board manufacturing technology. | Japan | Lit | 1,100.00 | 7,091.95 | 6.45 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | Product controller PH-5 , tp: sodium nitrate , acetic acid 3% , sodium acetate , water , solid content 41.3% , liquid 15 liters / bottle , 100% new (cas6131-90-4 , 7631- 99-4 , 64-19-7 , 7732-18-5) (LPL: 11464 / TB-TCHQ) | Japan | Lit | 90.00 | 768.96 | 8.54 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | Chemical processing used in plating , main products: support of acetate salts , nickel sulphates , sodium , additives in TOP SEAL acid field H-298 , liquid 20Lit / Can , New 100% (cas6018-89-9 , 7732-18-5) , PTPL: 10023 / TB-TCHQ | Japan | Lit | 15,000.00 | 44,722.61 | 2.98 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT P-6550C ELECTROLESS COPPER Organic Salt 20-30% , water 70-80% , which improve the adhesion and surface quality of products , in electronic circuit boards manufacturing | Japan | Lit | 200.00 | 1,800.00 | 9.00 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT P-6550M ELECTROLESS COPPER solution contains 75-85% water, Organic Salt: 15 - 25% , which enhances the adhesion and surface quality of products , in electronics boards manufacturing | Japan | Lit | 640.00 | 5,440.00 | 8.50 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | 3 # & CUPOSIT N solution contains 85-95% water, NiSO4 1-10% , H2SO4: 1- 10% , which improve the adhesion and surface quality of products , in manufacturing motherboards death | Japan | Lit | 200.00 | 2,760.00 | 13.80 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | 021 # & Chemical products used in plating technology (DEPLATER ST) | Japan | Lit | 200.00 | 1,023.14 | 5.12 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | 138 # & Chemical products used in plating technology (CUPSOL-M) | Japan | Lit | 200.00 | 1,724.75 | 8.62 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | 135 # & Chemical products used in plating technology (CUPSOL-A) | Japan | Lit | 120.00 | 1,191.36 | 9.93 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | 136 # & Chemical products used in plating technology (CUPSOL-B) | Japan | Lit | 200.00 | 2,372.39 | 11.86 | View Importer | View Supplier |
| 22/Jan/2019 | 38249999 | CuSO4 cleaning solution adheres to copper after product Copper Gleam HVS-202B (J) (water 85-95%; Polyalkylene glycol 5-15%; Polymer 1-5%; Sulfuric acid 0 , 1-1 %; Copper sulfate 0 , 1-1%) | Japan | Lit | 1,280.00 | 40,396.80 | 31.56 | View Importer | View Supplier |
| 21/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT P-6550M ELECTROLESS COPPER solution contains 75-85% water, Organic Salt: 15 - 25% , which enhances the adhesion and surface quality of products , in electronics boards manufacturing | Japan | Lit | 840.00 | 7,140.00 | 8.50 | View Importer | View Supplier |
| 21/Jan/2019 | 38249999 | 3 # & CUPOSIT N solution contains 85-95% water, NiSO4 1-10% , H2SO4: 1- 10% , which improve the adhesion and surface quality of products , in manufacturing motherboards death | Japan | Lit | 500.00 | 6,900.00 | 13.80 | View Importer | View Supplier |
| 21/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT P-6550C ELECTROLESS COPPER Organic Salt 20-30% , water 70-80% , which improve the adhesion and surface quality of products , in electronic circuit boards manufacturing | Japan | Lit | 320.00 | 2,880.00 | 9.00 | View Importer | View Supplier |
