31/Mar/2020 | 38249999 | Chemical preparations used as raw materials for the production of plating additives, in liquid form, with the composition of Propylene Glycol, symbol of goods COMP.31036FF, 200L / Drum, 100% new | Japan | liter | 200.00 | 4,136.81 | 20.68 | View Importer | View Supplier |
31/Mar/2020 | 38249999 | Chemical preparations used as raw materials for the production of plating additives, in liquid form, including Propylene Glycol, symbol of goods COMP.31036FF, 0.7L / Ctn, 100% new, (Goods FOC) | Japan | liter | 0.70 | 14.48 | 20.68 | View Importer | View Supplier |
30/Mar/2020 | 38249999 | CIRCUPOSIT P-6550M (VN) / 20L without water 75 - 85% and Organic salt 15 - 25%. Has the effect of improving adhesion and surface quality of products. Used in electronic circuit manufacturing technology. | Japan | liter | 1,280.00 | 9,157.80 | 7.15 | View Importer | View Supplier |
27/Mar/2020 | 38249999 | CuSO4 cleaning solution adheres to copper after product Copper Gleam HVS-202B (J) (water 85-95%; Polyalkylene glycol 5-15%; Polymer 1-5%; Sulfuric acid 0.1-1% ; Copper sulfate 0.1-1%) (1can = 20 Liter) | Japan | liter | 1,280.00 | 40,396.80 | 31.56 | View Importer | View Supplier |
25/Mar/2020 | 38249999 | Product controller PH-5, tp: sodium nitrate, 3% acetic acid precursor, sodium acetate, water, solid content 41.3%, liquid 15 liters / bottle, new 100% (cas64-19-7,7732-18-5) ( LPL: 11464 / TB-TCHQ) | Japan | liter | 30.00 | 262.07 | 8.74 | View Importer | View Supplier |
24/Mar/2020 | 38249999 | CUPOSIT N (VN) / 20L without water 85 - 95%, Nickel sulfate 1 - 10%, and Sulfuric acid 1- 10%. Has the effect of improving adhesion and surface quality of products. Capacitive in the technology of manufacturing electric circuit boards | Japan | liter | 320.00 | 3,461.45 | 10.82 | View Importer | View Supplier |
24/Mar/2020 | 38249999 | CIRCUPOSIT P-6550C (VN) / 20L without water 70 -80% and Organic salt 20 - 30%. Has the effect of improving adhesion and surface quality of products. Used in electronic circuit manufacturing technology. | Japan | liter | 640.00 | 4,622.06 | 7.22 | View Importer | View Supplier |
24/Mar/2020 | 38249999 | CuSO4 cleaning solution adheres to copper after product Copper Gleam HVS-202B (J) (water 85-95%; Polyalkylene glycol 5-15%; Polymer 1-5%; Sulfuric acid 0.1-1% ; Copper sulfate 0.1-1%) | Japan | liter | 960.00 | 23,318.23 | 24.29 | View Importer | View Supplier |
24/Mar/2020 | 38249999 | CIRCUPOSIT P-6550M (VN) / 20L without water 75 - 85% and Organic salt 15 - 25%. Has the effect of improving adhesion and surface quality of products. Used in electronic circuit manufacturing technology. | Japan | liter | 1,280.00 | 8,759.36 | 6.84 | View Importer | View Supplier |
20/Mar/2020 | 38249999 | COSMO K-1 COPPER PLATINAL ADDITIVES, FOR CREATING RESPONSE TO HELP GOOD GRINDING COPPER PLATED IN SPINDLE PRODUCTS. ASSESSED AT TTPTPLMN NO 1450 | Japan | liter | 760.00 | 6,384.00 | 8.40 | View Importer | View Supplier |
20/Mar/2020 | 38249999 | COSMO K-2 COPPER PLUG ADDITIVE, USED TO CREATE REACTIVITY TO HELP GOOD GRINDING COPPER PLATED IN SPINDLE PRODUCTS. ASSESSED AT TTPTPLMN NO 1450 | Japan | liter | 760.00 | 6,384.00 | 8.40 | View Importer | View Supplier |
20/Mar/2020 | 38249999 | CuSO4 cleaning solution adheres to copper after product Copper Gleam HVS-202B (J) (water 85-95%; Polyalkylene glycol 5-15%; Polymer 1-5%; Sulfuric acid 0.1-1% ; Copper sulfate 0.1-1%) | Japan | liter | 1,280.00 | 30,593.02 | 23.90 | View Importer | View Supplier |
19/Mar/2020 | 38249999 | CM-00066 # & CUPOSIT N solution contains 85-95% water, NiSO4 1-10%, H2SO4: 1- 10%, which improve the adhesion and surface quality of products, in electronic circuit boards manufacturing | Japan | liter | 320.00 | 4,416.00 | 13.80 | View Importer | View Supplier |
19/Mar/2020 | 38249999 | CM-00048 # & CIRCUPOSIT P-6550M ELECTROLESS COPPER solution contains 75-85% water, Organic Salt: 15-25%, which enhance the adhesion and surface quality of products, in electronic circuit boards manufacturing | Japan | liter | 640.00 | 5,440.00 | 8.50 | View Importer | View Supplier |
18/Mar/2020 | 38249999 | 0 # & CuSO4 cleaning solution sticking on the surface of the product after copper plating Copper Gleam HVS-202B (J) (water 85-95%; Polyalkylene glycol 5-15%; Polymer 1-5%; Sulfuric acid 0.1- 1%; Copper sulfate 0.1-1%), new 100% | Japan | liter | 100.00 | 3,430.00 | 34.30 | View Importer | View Supplier |