17/Mar/2020 | 84862099 | S003532 # & Flip Chip Bonder Machine (FCB Dev02). Model: AFM-15, brand TDK, production year 2018. Used products | Japan | set | 1.00 | 318,436.76 | 318,436.76 | View Importer | View Supplier |
12/Mar/2020 | 84862099 | Tape sealing machine for wafer sheet surface during wafer plate thinning process, in RAD-3520F / 12 IC plate manufacturing (S / N: D20S000124), 200-230V, 1phase 50 / 60Hz, 3KW, manufacturer xx: LINTEC, production year: 2020, brand new 100% | Japan | set | 1.00 | 340,266.08 | 340,266.08 | View Importer | View Supplier |
09/Mar/2020 | 84862091 | TSCD2003001 # & CF2-0907 laser board cutting machine (used products, production year 2012) | Japan | set | 1.00 | 6,248.48 | 6,248.48 | View Importer | View Supplier |
04/Mar/2020 | 84861040 | Wafer shearing machine in manufacturing chipboard model DFD6361, serial KF2551, voltage 200V-240VAC (50 / 60Hz) 3phase, production year 06/2011, Disco manufacturer, used goods | Japan | set | 1.00 | 155,117.33 | 155,117.33 | View Importer | View Supplier |