| Date | HS Code | Product Description | Origin Country | Unit | Quantity | Total Value [USD] | Unit Price [USD] | Importer Name | Supplier Name |
|---|---|---|---|---|---|---|---|---|---|
| 17/Mar/2020 | 84862099 | S003532 # & Flip Chip Bonder Machine (FCB Dev02). Model: AFM-15, brand TDK, production year 2018. Used products | Japan | set | 1.00 | 318,436.76 | 318,436.76 | View Importer | View Supplier |
| 12/Mar/2020 | 84862099 | Tape sealing machine for wafer sheet surface during wafer plate thinning process, in RAD-3520F / 12 IC plate manufacturing (S / N: D20S000124), 200-230V, 1phase 50 / 60Hz, 3KW, manufacturer xx: LINTEC, production year: 2020, brand new 100% | Japan | set | 1.00 | 340,266.08 | 340,266.08 | View Importer | View Supplier |
