| 30/Jan/2019 | 38249999 | CIRCUPOSIT P-6550M (VN) / 20L without water 75 - 85% and Organic salt 15 - 25%. Has the effect of improving adhesion and surface quality of products. Used in electronic board manufacturing technology. | Japan | Lit | 1,100.00 | 7,091.95 | 6.45 | View Importer | View Supplier |
| 28/Jan/2019 | 38101000 | Purified metal cleaning products used in oxygen , liquid , 20 liters / canTOP RIP PF-1 , tp: compound of compound , sodium hydroxide , basic salt and organic chemicals , new 100% (107-15-3 , 102-71-6 , 1310-73 -2 , 141-43-5) KQPTPL9159 / TB-TCHQ | Japan | Lit | 260.00 | 2,013.18 | 7.74 | View Importer | View Supplier |
| 28/Jan/2019 | 38101000 | Cleaning products of metal surfaces TOP RIP N-1 , tp: 25% Aqueous ammonia , water and organic compounds , liquid , liquid 20 liters / can , New 100% (cas 1336-21-6 , 7732-18-5 ) (IRR: 27 / BB-HC13) | Japan | Lit | 100.00 | 525.10 | 5.25 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | Chemical processing used in plating , main products: support of acetate salts , nickel sulphates , sodium , additives in TOP SEAL acid field H-298 , liquid 20Lit / Can , New 100% (cas6018-89-9 , 7732-18-5) , PTPL: 10023 / TB-TCHQ | Japan | Lit | 15,000.00 | 44,722.61 | 2.98 | View Importer | View Supplier |
| 26/Jan/2019 | 38099300 | Finished products used in plating , finishing substances / Top Nicoron SA-98-TLF (1 can = 20 liters). 100% new goods # & JP | Japan | Lit | 100.00 | 799.00 | 7.99 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT P-6550C ELECTROLESS COPPER Organic Salt 20-30% , water 70-80% , which improve the adhesion and surface quality of products , in electronic circuit boards manufacturing | Japan | Lit | 200.00 | 1,800.00 | 9.00 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT P-6550M ELECTROLESS COPPER solution contains 75-85% water, Organic Salt: 15 - 25% , which enhances the adhesion and surface quality of products , in electronics boards manufacturing | Japan | Lit | 640.00 | 5,440.00 | 8.50 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | 3 # & CUPOSIT N solution contains 85-95% water, NiSO4 1-10% , H2SO4: 1- 10% , which improve the adhesion and surface quality of products , in manufacturing motherboards death | Japan | Lit | 200.00 | 2,760.00 | 13.80 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | 021 # & Chemical products used in plating technology (DEPLATER ST) | Japan | Lit | 200.00 | 1,023.14 | 5.12 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | 138 # & Chemical products used in plating technology (CUPSOL-M) | Japan | Lit | 200.00 | 1,724.75 | 8.62 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | 135 # & Chemical products used in plating technology (CUPSOL-A) | Japan | Lit | 120.00 | 1,191.36 | 9.93 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | 136 # & Chemical products used in plating technology (CUPSOL-B) | Japan | Lit | 200.00 | 2,372.39 | 11.86 | View Importer | View Supplier |
| 21/Jan/2019 | 38101000 | DVLCT1821 # & Plating additives - Cleansing products containing nonionic surfactants, liquid (plating additives) EBASOLDER SE II D , CTHH: CH4O3S. TP: Alkyl sulfonic acid , 100% new | Japan | Lit | 20.00 | 645.20 | 32.26 | View Importer | View Supplier |
| 21/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT P-6550M ELECTROLESS COPPER solution contains 75-85% water, Organic Salt: 15 - 25% , which enhances the adhesion and surface quality of products , in electronics boards manufacturing | Japan | Lit | 840.00 | 7,140.00 | 8.50 | View Importer | View Supplier |
| 21/Jan/2019 | 38249999 | 3 # & CUPOSIT N solution contains 85-95% water, NiSO4 1-10% , H2SO4: 1- 10% , which improve the adhesion and surface quality of products , in manufacturing motherboards death | Japan | Lit | 500.00 | 6,900.00 | 13.80 | View Importer | View Supplier |
