| 30/Mar/2020 | 35069900 | 5CHJ00184A # & Adhesive components (SA2201DN-30G), components include: Bisphenol F type epoxy resin (liquid), Synthetic Resins, Bisphenol A type Epoxy Resin, Silica, Polymerization initiators. (1CC = 1G) .New 100% | Japan | g | 6,000.00 | 21,873.60 | 3.65 | View Importer | View Supplier |
| 30/Mar/2020 | 35069900 | 5CHJ00306A # & Component adhesives (SA2202DN), including: Bisphenol F type epoxy resin (liquid), Synthetic Resins, Bisphenol A type Epoxy Resin, Silica, Polymerization initiators. (1CC = 1G). 100% new | Japan | g | 10,500.00 | 72,090.90 | 6.87 | View Importer | View Supplier |
| 30/Mar/2020 | 35069900 | LGD_0104 # & Resin adhesives ** ThreeBond, 1538B used in OLED TV assembly process (Main components: Carbon black, Tin compounds, Silyl group terminated polymer, inorganic filler, Silica) | Japan | g | 9,500.00 | 1,047.38 | 0.11 | View Importer | View Supplier |
| 28/Mar/2020 | 35030019 | HSV04 # & Glue SA2235-V05 30G-M 30ML-SEMN with Epoxy resin (MW 700), [3- (2,3-epoxypropoxy) propyl] trimethoxysilane (100% new) | Japan | g | 3,000.00 | 9,514.20 | 3.17 | View Importer | View Supplier |
| 27/Mar/2020 | 35030019 | HSV04 # & Plenset Glue AE-421D, composition Epoxy resin (MW 700), Methylethylketoxime 100% new | Japan | g | 5,600.00 | 18,280.00 | 3.26 | View Importer | View Supplier |
| 27/Mar/2020 | 35069100 | AS760448 # & UV RESIN Glue (LCR-0635) used to attach cable core (50 gram / pce) | Japan | g | 150.00 | 673.95 | 4.49 | View Importer | View Supplier |
| 27/Mar/2020 | 35069100 | AHD-DB-1137B # & Glue DB-1137B (Thermoplastic rubber 10-20%, Synthetic Resin 10-20%, Carbon black 0-10%, High boiling solvent 10-20%, Methylcyclohexane 20-30%, Ethylacetate 20- 30%), New 100%, M02-73529 | Japan | g | 30,000.00 | 621.00 | 0.02 | View Importer | View Supplier |
| 27/Mar/2020 | 35069900 | NPI-XV6842-197 # & Glue used in camera module manufacturing. Ingredients: Resins, Bisphenol A type, F type, Amine type hardener, silicon dioxide. Manufacturer: Namics Corporation, 100% new. | Japan | g | 1,500.00 | 150.00 | 0.10 | View Importer | View Supplier |
| 27/Mar/2020 | 35069900 | NPI-XV6842-197 # & Glue used in camera module manufacturing. Ingredients: Resins, Bisphenol A type, F type, Amine type hardener, silicon dioxide. Manufacturer: Namics Corporation, 100% new. | Japan | g | 1,120.00 | 112.00 | 0.10 | View Importer | View Supplier |
| 27/Mar/2020 | 35069900 | NPI-XV6842-197 # & Glue used in camera module manufacturing. Ingredients: Resins, Bisphenol A type, F type, Amine type hardener, silicon dioxide. Manufacturer: Namics Corporation, 100% new. | Japan | g | 480.00 | 48.00 | 0.10 | View Importer | View Supplier |
| 27/Mar/2020 | 35069900 | NPI-XV6842-197 # & Glue used in camera module manufacturing. Ingredients: Resins, Bisphenol A type, F type, Amine type hardener, silicon dioxide. Manufacturer: Namics Corporation, 100% new. | Japan | g | 3,600.00 | 360.00 | 0.10 | View Importer | View Supplier |
| 26/Mar/2020 | 35069900 | 0201-003047 # & GLUE GLUE AE-421D (CONTAINING Bisphenol F epoxy resin 25-355, Epoxy resin hardener 25-35%) MOUNTING LIGHT FILTERS AND TRANSMISSORS | Japan | g | 2,800.00 | 8,947.49 | 3.20 | View Importer | View Supplier |
| 25/Mar/2020 | 35061000 | VT0001 # & NUTRITION: Cemedine EP001N (base resin + hardener, 40gr / can) | Japan | g | 800.00 | 94.15 | 0.12 | View Importer | View Supplier |
| 25/Mar/2020 | 35061000 | B10 # & Resin = Glue = glue (1 tube = 15/20/35 grams) | Japan | g | 4,500.00 | 17,989.00 | 4.00 | View Importer | View Supplier |
| 25/Mar/2020 | 35061000 | B10 # & Resin = Glue = glue (1 tube = 15/20/35 grams) | Japan | g | 3,150.00 | 14,471.10 | 4.59 | View Importer | View Supplier |
