| 31/Mar/2020 | 35061000 | HNYY # & KE-3494 silicon resin, 330ml / SH | Japan | bottle / jar / tube | 160.00 | 3,320.00 | 20.75 | View Importer | View Supplier |
| 31/Mar/2020 | 35061000 | HNYY # & KE-4898-W silicone resin, 330ml | Japan | bottle / jar / tube | 40.00 | 624.00 | 15.60 | View Importer | View Supplier |
| 31/Mar/2020 | 35069900 | Adhesive (UV Curable Resin 70g SA2235-V05), containing acrylic esters 60-70%, 2-hydroxyethyl methacrylate 10-20%, used to stick the product. New 100% | Japan | piece/pcs | 16.00 | 2,800.00 | 175.00 | View Importer | View Supplier |
| 30/Mar/2020 | 35069900 | 5CHJ00184A # & Adhesive components (SA2201DN-30G), components include: Bisphenol F type epoxy resin (liquid), Synthetic Resins, Bisphenol A type Epoxy Resin, Silica, Polymerization initiators. (1CC = 1G) .New 100% | Japan | g | 6,000.00 | 21,873.60 | 3.65 | View Importer | View Supplier |
| 30/Mar/2020 | 35069900 | 5CHJ00306A # & Component adhesives (SA2202DN), including: Bisphenol F type epoxy resin (liquid), Synthetic Resins, Bisphenol A type Epoxy Resin, Silica, Polymerization initiators. (1CC = 1G). 100% new | Japan | g | 10,500.00 | 72,090.90 | 6.87 | View Importer | View Supplier |
| 30/Mar/2020 | 35069900 | 2451882500 HOTMELT M800G thermal glue (Titanium dioxide 4%, Calcium oxide 3%, C5 / C9 petroleum resin 41%, Styrene-butadien rubber series 40%) (17kg / carton). New 100%. | Japan | kg | 2,295.00 | 14,118.20 | 6.15 | View Importer | View Supplier |
| 30/Mar/2020 | 35069900 | 6351997900 HOTMELT M-555-GE thermal glue (Titanium dioxide 1%, Calcium oxide 3%, C5 / C9 petroleum resin 49%, Styrene-butadien rubber series 33%) (17kg / carton). New 100%. | Japan | kg | 765.00 | 4,651.50 | 6.08 | View Importer | View Supplier |
| 30/Mar/2020 | 35069900 | LGD_0104 # & Resin adhesives ** ThreeBond, 1538B used in OLED TV assembly process (Main components: Carbon black, Tin compounds, Silyl group terminated polymer, inorganic filler, Silica) | Japan | g | 9,500.00 | 1,047.38 | 0.11 | View Importer | View Supplier |
| 28/Mar/2020 | 35069900 | MT10 # & Adhesives - P7122901 - BONDING 2222 - Bisphenol F type epoxy resin, liquid | Japan | kg | 40.00 | 2,095.24 | 52.38 | View Importer | View Supplier |
| 27/Mar/2020 | 35061000 | MMEO01 # & Glue (UV curing type resist UVF-10T (KAI)) used to adjust the focus of camera module, Tp mainly Epoxy acrylate resin 35-45%, Acrylic monomer 30-40%, othes. 100% new | Japan | bottle / jar / tube | 2.00 | 20.00 | 10.00 | View Importer | View Supplier |
| 27/Mar/2020 | 35069100 | AS760448 # & UV RESIN Glue (LCR-0635) used to attach cable core (50 gram / pce) | Japan | g | 150.00 | 673.95 | 4.49 | View Importer | View Supplier |
| 27/Mar/2020 | 35069100 | AHD-DB-1137B # & Glue DB-1137B (Thermoplastic rubber 10-20%, Synthetic Resin 10-20%, Carbon black 0-10%, High boiling solvent 10-20%, Methylcyclohexane 20-30%, Ethylacetate 20- 30%), New 100%, M02-73529 | Japan | g | 30,000.00 | 621.00 | 0.02 | View Importer | View Supplier |
| 27/Mar/2020 | 35069900 | NPI-XV6842-197 # & Glue used in camera module manufacturing. Ingredients: Resins, Bisphenol A type, F type, Amine type hardener, silicon dioxide. Manufacturer: Namics Corporation, 100% new. | Japan | g | 1,500.00 | 150.00 | 0.10 | View Importer | View Supplier |
| 27/Mar/2020 | 35069900 | NPI-XV6842-197 # & Glue used in camera module manufacturing. Ingredients: Resins, Bisphenol A type, F type, Amine type hardener, silicon dioxide. Manufacturer: Namics Corporation, 100% new. | Japan | g | 1,120.00 | 112.00 | 0.10 | View Importer | View Supplier |
| 27/Mar/2020 | 35069900 | NPI-XV6842-197 # & Glue used in camera module manufacturing. Ingredients: Resins, Bisphenol A type, F type, Amine type hardener, silicon dioxide. Manufacturer: Namics Corporation, 100% new. | Japan | g | 480.00 | 48.00 | 0.10 | View Importer | View Supplier |
